1.25mm Pitch Wire to Board Connector Amphenol 10114828-10103LF with Halogen Free PCB Header Material
Product Overview
The Amphenol Basics Minitek 1.25mm wire-to-board connector system is a high-quality, compact solution designed for a wide range of applications across Industrial, Automotive, and Consumer markets. This comprehensive system includes terminals, crimp housings, and PCB headers available in straight and right-angle, surface mount, and through-hole configurations. It supports 2 to 15 circuits in a single row and is engineered to prevent accidental mismating with fully polarized housings and a crimp housing with a friction feature for enhanced retention. The system conforms to EU Industry Safety Standards, with PCB header material meeting halogen-free requirements and operating within a temperature range of -40C to +105C. It is suitable for applications requiring space savings due to its 1.25mm pitch and accommodates a wire range up to 32AWG-28AWG.
Product Attributes
- Brand: Amphenol Basics Minitek
- Pitch: 1.25mm
- Circuit Range: 2 to 15 circuits
- Housings: Fully polarized with friction feature
- PCB Header Material: High temperature thermoplastic, UL94V-0, Halogen-free resin
- Certifications: EU Industry Safety Standard, UL approval, RoHS compliant (EU Directive 2002/95/EC), Glow Wire Test (IEC 60695-2)
- Packaging: Tape and Reel (PCB Header), Bag (Crimping Housing), Reel (Terminal)
- Lead-free: Yes
Technical Specifications
| Specification | Details |
|---|---|
| Contact Material | Copper Alloy |
| Contact Plating Options | Matte Tin, Gold flash, 15in. Gold, 30in. Gold over Nickel |
| Housing Material | Thermoplastic high temperature, UL94V-0 |
| Metal Hold Down Material | Copper Alloy |
| Metal Hold Down Plating | Matt Tin |
| Contact Resistance | 20m max. |
| Insulation Resistance | 100M min. |
| Voltage Rating | 125VAC, VDC |
| Current Rating | 1A (0.8A - 32AWG) |
| Dielectric Withstand Voltage | 500VAC/minute |
| Mating & Un-mating Force | Conforms to EIA-364-13 |
| Contact Retention Force | 0.5Kgf min. |
| Hold Down/Housing Retention Force | 1.0Kgf min. |
| Wire Retention Force | 0.5Kgf min. |
| Terminal/Housing Retention Force | 0.5Kgf min. |
| Vibration | 1s max., EIA-364-28 Condition I |
| Shock | 1s max., EIA-364-27A |
| Durability | 30 cycles |
| Resistance to Re-flow Soldering Heat | Pre-heat: 150C to 180C, 60-90s; Heat: 230C min., 40s min.; Peak Temp: 260C max., 10s max. |
| Resistance to Hand Soldering Heat | Soldering iron: 35010C, Duration: 3S-4S min. |
| Thermal Shock | Conforms to EIA-364-32A |
| Humidity (temperature cycling) | Conforms to EIA-361-31A |
| Temperature Life (heat aging) | Conforms to EIA-361-17A, 105C for 96 hours |
| Salt Spray | Conforms to EIA-364-26B |
| Solderability | Min. 95% solder coverage on solderable area |
| Operating Temperature Range | -40C to +105C |
| Product Specifications Document | GS-12-675 |
| Packaging Specifications Documents | GS-14-1592; GS-14-1593 |
Target Markets/Applications
- Car Audio Industry
- Control Instrumentation/Metering
- Office Equipment
- Small Motor/Robot Control
- Security Alarm Systems
- Vending POS Machine
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