2.5mm Pitch Wire to Board Connector BOOMELE Boom Precision Elec XH-4AWD Terminal Housing Wafer Assembly
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification covers the 2.5mm Pitch Wire to Board Connector series. Designed for reliable electrical connections, these connectors are suitable for a wide range of applications requiring secure wire-to-board termination. The series includes terminals, housings, and right-angle surface mount (SMT) wafer assemblies, all manufactured to meet stringent performance and durability standards.
Product Attributes
- Brand: BOOMELE
- Product Series: XH SERIES
- Certifications: LEAD FREE
Technical Specifications
| Category | Item | Specification | Details |
|---|---|---|---|
| Product Identification | Product Name | Terminal, Housing, Wafer Assembly | |
| Part Number | XH-PT (Terminal), XH-Y (Housing), XH-A/AW/AWD/AWD(K) (Wafer Assembly) | ||
| Packaging Quantity | Terminal: 6K, Housing: 1K, Wafer Assembly: 1K | ||
| Ratings | Rated Voltage (MAX.) | 250V | |
| Rated Current (MAX.) | 3A (AWG #22 to #32) | ||
| Ambient Temperature Range | -25 to +85 | ||
| Applicable Wire | AWG #22 to #32 | ||
| Max. Insulation O.D. | 1.0mm | ||
| Electrical Performance | Contact Resistance (mated) | 20 milliohm MAX. | Test Condition: Mate connectors, measure by dry circuit, 20mV MAX., 30mA. |
| Insulation Resistance | 100 Megohm MIN. | Test Condition: Apply 500V DC between adjacent terminals or terminal and ground. | |
| Dielectric Strength | No Breakdown | Test Condition: Apply 1000V AC(rms) between adjacent terminals or terminal and ground for 1 minute. | |
| Contact Resistance (crimped portion) | 5 milliohm MAX. | Test Condition: Crimp applicable wire to terminal, measure by dry circuit, 20mV MAX., 30mA. | |
| Mechanical Performance | Insertion and Withdrawal Force (Connector) | Refer to paragraph 7 | Test Condition: Insert and withdraw connectors at 25+3mm/minute. |
| Crimping Strength | AWG #22: 9.8 N (1.0kgf) MIN. AWG #32: 4.9 N (0.5kgf) MIN. | Test Condition: Fix crimped terminal, apply axial pull out force on wire at 25+3mm/minute. | |
| Terminal Insertion Force (into Housing) | 4.9 N (0.5kgf) MAX. | Test Condition: Insert crimped terminal into housing. | |
| Terminal/Housing Retention Force | 4.9 N (0.5kgf) MIN. | Test Condition: Apply axial pull out force to terminal in housing at 25+3mm/minute. | |
| Pin Retention Force | 4.9 N (0.5kgf) MIN. | Test Condition: Apply axial push force at 25+3mm/minute. | |
| Durability & Environmental Performance | Mechanical Life (Repeated Insertion/Withdrawal) | Contact Resistance: 40 milliohm MAX. | Test Condition: 30 cycles at 10 cycles/minute. |
| Temperature Rise (at rated current) | 30 MAX. | Test Condition: Carrying rated current load (UL 498). | |
| Vibration | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Discontinuity: 1.0 microsecond MAX. | Test Condition: 1.5mm P-P, 10-55-10 Hz/min, 2 hours each axis (MIL-STD-202 Method 201). | |
| Shock | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Discontinuity: 1.0 microsecond MAX. | Test Condition: 490m/s {50G}, 3 strokes each axis (JIS C60068-2-27/MIL-STD-202 Method 213). | |
| Heat Resistance | Appearance: No Damage Contact Resistance: 40 milliohm MAX. | Test Condition: 96 hours at 83-87 (JIS C60068-2-2/MIL-STD-202 Method 108). | |
| Cold Resistance | Appearance: No Damage Contact Resistance: 40 milliohm MAX. | Test Condition: 96 hours at -37 to -43 (JIS C60068-2-1). | |
| Humidity | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Dielectric Strength: Must meet 4-1-3 Insulation Resistance: 10 Megohm MIN. | Test Condition: 96 hours at 58-62, 90-95% RH (JIS C60068-2-3/MIL-STD-202 Method 103). | |
| Soldering Performance | Solderability | Solder Wetting: 95% of immersed area must show no voids, pin holes. | Test Condition: Soldering Time 2-3 sec, Solder Temp 242-248, 0.5mm from tip. |
| Resistance To Solder Heat | No Damage | Test Condition: Soldering iron method, Time 2-4 sec, Temp 370-400, 0.5mm from tip. | |
| Infrared Reflow Condition | Peak Temp: 250 MAX. Time (above 230): 30 SEC. Total Time: 120 SEC. (Pre-heat: 150200) | Note: Conditions may vary based on soldering equipment and PC boards. | |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina