wire to board connector series BOOMELE Boom Precision Elec TJC2-4A with 7.5 to 5.0 millimeter pitch
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The TJC2 SERIES is a 7.5-5.0mm pitch wire-to-board connector series designed for reliable electrical connections. This series offers a range of components including terminals, housings, and wafer assemblies, suitable for various wire gauges from AWG #18 to #24. With a rated voltage of 250V and a maximum rated current of 5A, these connectors are engineered for demanding applications within an ambient temperature range of -25 to +120.
Product Attributes
- Brand: BOOMELE
- Series: TJC2 SERIES
- Certifications/Standards: JIS C5402, MIL-STD-202, UL 498, JIS C60068-2-27, JIS C60068-2-2, JIS C60068-2-1, JIS C60068-2-3, JIS C0025, JIS C5028
- Lead Free: Yes
- Packaging Options: Embossed Tape Package, Embossed Tape Package Silicagel Package
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| General Specifications | ||
| Pitch | 7.5-5.0mm | Wire to Board Connector Series |
| Rated Voltage (MAX.) | 250 V | |
| Maximum Insulation O.D. | 1.0mm | |
| Rated Current (MAX.) | 5A | For AWG #18 to #24 |
| Ambient Temperature Range | -25+120 | Including terminal temperature rise (*1) |
| Electrical Performance | ||
| Contact Resistance (mated) | 20 milliohm MAX. | Test condition: Mate connectors, measure by dry circuit, 10mV MAX., 50mA. (JIS C5402 5.4) |
| Insulation Resistance | 100 Megohm MIN. | Test condition: Apply 500V DC between adjacent terminals or terminal and ground. (JIS C5402 5.2/MIL-STD-202 Method 302) |
| Dielectric Strength | No Breakdown | Test condition: Apply 1500V AC(rms) between adjacent terminals or terminal and ground for 1 minute. (JIS C5402 5.1/MIL-STD-202 Method 301) |
| Contact Resistance on Crimped Portion | 5 milliohm MAX. | Test condition: Crimp the applicable wire to the terminal, and measure contact resistance by dry circuit, 10mV MAX., 50mA. |
| Mechanical Performance | ||
| Insertion and Withdrawal Force (Connector) | Refer to paragraph 7 | Test speed: 253mm/minute |
| Crimping Strength (AWG #18) | 9.8 N (1.0kgf) MIN. | Test speed: 253mm/minute, axial pull out force on wire |
| Crimping Strength (AWG #24) | 4.9 N (0.5kgf) MIN. | Test speed: 253mm/minute, axial pull out force on wire |
| Terminal Insertion Force (into Housing) | 4.9 N (0.5kgf) MAX. | |
| Terminal/Housing Retention Force | 4.9 N (0.5kgf) MIN. | Test speed: 253mm/minute, axial pull out force |
| Pin Retention Force | 4.9 N (0.5kgf) MIN. | Test speed: 253mm/minute, axial push force |
| Mechanical Life | 40 milliohm MAX. (Contact Resistance) | 30 cycles repeatedly at 10 cycles per minute |
| Temperature Rise (at rated current) | 30 MAX. | (UL 498) |
| Vibration | No Damage, 40 milliohm MAX. (Contact Resistance), 1.0 microsecond MAX. (Discontinuity) | Amplitude 1.5mm P-P, 10-55-10 Hz/min, 2 hours each in X.Y.Z axes. (MIL-STD-202 Method 201) |
| Shock | No Damage, 40 milliohm MAX. (Contact Resistance), 1.0 microsecond MAX. (Discontinuity) | 490m/s2 {50G}, 3 strokes each in X.Y.Z axes. (MIL-STD-202 Method 213) |
| Heat Resistance | No Damage, 40 milliohm MAX. (Contact Resistance) | 96 hours at 852. (MIL-STD-202 Method 108) |
| Cold Resistance | No Damage, 40 milliohm MAX. (Contact Resistance) | 96 hours at -37 to -43. (JIS C60068-2-1) |
| Humidity | No Damage, 40 milliohm MAX. (Contact Resistance), 10 Megohm MIN. (Insulation Resistance), Meets 4-1-3 (Dielectric Strength) | 96 hours at 58-62, 90-95% RH. (JIS C60068-2-3) |
| Temperature Cycling | No Damage, 40 milliohm MAX. (Contact Resistance) | 5 cycles of: a) -55 for 30 min, b) +105 for 30 min. (JIS C0025) |
| Salt Spray | No Damage, 40 milliohm MAX. (Contact Resistance) | 44-52 hours exposure to 51% salt spray solution at 352. (JIS C5028/MIL-STD-202 Method 101) |
| SO2 Gas | No Damage, 40 milliohm MAX. (Contact Resistance) | 24 hours expose to 505ppm SO2 gas at 402. |
| NH3 Gas | No Damage, 40 milliohm MAX. (Contact Resistance) | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. |
| Solderability | 95% of immersed area must show no voids, pin holes (Solder Wetting) | Soldering Time: 2-3 sec. Solder Temperature: 242-248. 0.5mm from terminal tip and fitting nail tip. |
| Resistance To Soldering Heat | No Damage | Soldering iron method: Time: 31 sec. Temperature: 370-400. 0.5mm from terminal tip and fitting nail tip. |
| Infrared Reflow Conditions | ||
| Peak Temp. | 250 MAX. | |
| Time at 230 MIN. | 30 SEC. | |
| Pre-heat (150200) | 120 SEC. | |
| Product Components | ||
| Terminal | TJC2 | Applicable Wire: AWG #18-24 |
| Housing | TJC2-Y | |
| Wafer Assembly (R/A) | TJC2-A | Lead Free |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
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Contact Person
Sellina