wire to PC board connector BOOMELE Boom Precision Elec HY-2P designed for stable electrical connections

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Product Description

Product Overview

The HY series connector strip is designed for reliable electrical connections, offering a range of specifications for performance, testing, and environmental conditions. It is suitable for applications requiring connections between wires and PC boards, with a focus on durability and electrical integrity. The connectors are designed for use within a specified ambient temperature range and are compatible with various wire gauges and PC board thicknesses.

Product Attributes

Product Series: HY series
Material - Terminal Contact: Phosphor bronze (0.20mm thickness)
Material - Housing: Nylon66 (UL94V-0), Color: White
Material - Wafer Pin: Brass (0.50mm thickness)
Material - Wafer Housing: Nylon66 (UL94V-0), Color: White
Material - Wafer Pin (Alternative): Brass (0.50mm thickness)
Material - Wafer Housing (Alternative): LCP (UL94V-0), Color: Beige
Material - Solder Tab: Brass (0.40mm thickness)
Material - Solder Tab (Alternative): Phosphor bronze (0.25mm thickness)
Plating - Terminal: Tin Plating (3-5m)
Plating - Wafer Pin: Tin Plating (2.5-5m)
Plating - Solder Tab: Tin Plating (3-5m)
Certifications: RoHS

Technical Specifications

Item	Test Mode / Description	Requirement / Specification
1. Scope
	Applicable to	HY series connector strip, including product performance, test methods and inspection requirements.
2. Applicable Standards
2.1	GB/T2421	Testing method for Environmental of Electrical Connectors Class 1: General Principles
2.2	GB/T2423	Testing method for Environmental of Electrical Connectors
2.3	GB/T2424	Testing method for Environmental of Electrical Connectors
2.4	GB/T5095	Testing Procedure/method for components of electric equipment
3. Use Condition
3.1	Ambient temperature Range	-25+85
3.2	Applicable Wire Sizes	AWG#24#30
3.3	Applicable PC board thickness	0.8~1.6mm
4. Appearance and Dimension
4.1	Appearance	Product surface without defect, dirt, crack, and mechanical damage. Contact without rust, plating not oxidized and not peeled.
4.2	Dimension	According to drawings
4.3	Exchangable	Exchangeable with same specification products.
6. Electrical Performance
6.1	Rated Current	2A (AC/DC)
6.2	Rated Voltage	250V (AC/DC)
6.3	Contact Resistance	Initial value: 20m (Max. 20mV, 100mA applied to mate connector, excluding wire resistance)
6.4	Withstand Voltage	1000V AC (rms) for 1 minute (adjacent terminals to ground), leakage current 0.5mA. No breakdown or flashover.
6.5	Insulation Resistance	1000 M (500V DC for 1 minute between adjacent contacts)
7. Mechanical Performance
7.1	Terminal crimping wire strength (Pullout force)	AWG#24: 30N AWG#26: 20N AWG#28: 13N AWG#30: 8N (Pullout rate: 25 3mm/min)
7.2	Fixed terminals and hole seat (Pullout force per contact)	15N (Pullout rate: 25 3mm/min along wire direction)
7.3	Single contact insertion force	6N (Insertion rate: 25 3mm/min)
7.4	Single contact withdrawal force	0.5N (Withdrawal rate: 25 3mm/min)
7.5	Pin Retention force (Per contact)	15N (Pullout rate: 25 3mm/min)
7.6	Durability	30 cycles (Max. 10 cycles/min). Contact Resistance: 30 m.
7.7	Vibration	Frequency: 10-55-10 Hz/min, Amplitude: 1.5mm p-p, Duration: 2 hours per axis (X, Y, Z). Appearance: No damage. Contact Resistance: 30 m. Current Discontinuity: 1sec Max.
8. Endurance Characteristics (Environmental Performance)
8.1	Thermal Aging	Temperature: 85 2, Period: 96 hours. Appearance: No damage. Contact Resistance: 30 m.
8.2	Temperature Rise	Max 30 (Measured at contact when maximum rated current is passed)
8.3	Humidity	Temperature: 40 2, RH: 90-95%, Period: 96 hours. Appearance: No damage. Contact Resistance: 30m. Insulation Resistance: 500M. No breakdown or flashover.
8.4	Temperature Cycling	5 cycles: (-553, 30min) -> Room temp. (10-15min) -> (853, 30min) -> Room temp. (10-15min). Same requirements as 8.3.
8.5	Salt Spray	Temperature: 353, Solution: 51%. Period: 8 hours (Post-plating), 48 hours (Pre-plating). Appearance: No damage. Contact Resistance: 30 m.
8.6	Solderability	Solder Temperature: 2455, Immersion: 30.5S. Soldering Area: 90%.
8.7	Resistance to Soldering Heat	Manual Soldering: 30.5S at 3055. Wave Soldering: 50.5S at 2305. Reflow Soldering: Max 20S at 2555. Appearance: No damage.
10. Caution
10.1	Moisture Absorption	Avoid exposure to temperatures > 30 and humidity > 60%RH after opening package. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering.
11. Packaging, Transportation, Storage
11.1	Packaging	Terminals: Reel packaging. Housings: Plastic bags. Headers: Reel, bag packaging. Includes certificate with product name, spec, quantity, date. Exterior: Carton with packing list. Product must not move within the box.
11.2	Transportation	Any method, avoid direct rain/sunlight, mechanical damage. Temperature: -20~+50.
11.3	Storage	Temperature: -10 to +40, RH 80%. Store in a warehouse free of acidic, alkaline, or corrosive gases. Re-qualification test required after 6 months of storage.