ZIF R A Type K SMT Connector 1.0mm Pitch 2.5mm Height CAX CAX-AFA07-14XCB-H2.5 for Electronic Devices

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Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. Designed for reliable connections, these connectors are suitable for applications requiring a 1.0mm pitch and a height of 2.5mm. They are manufactured by Zhejiang Chuang Du Electronics Co., Ltd.

Product Attributes

  • Brand: ZHE JIANG CHUANG DU ELECTRONICS CO.,LTD
  • Origin: China
  • Housing Material: LCP (Natural Color, UL94V-0 Flammability Rating)
  • Latch Material: LCP (Black Color, UL94V-0 Flammability Rating)
  • Terminal Material: Phosphor Bronze
  • Fitting Nail Material: Phosphor Bronze
  • Packaging Options: Tube packaging (small batch), Reel packaging (bulk order recommended)

Technical Specifications

Item Specifications Test Condition
Ratings
Operating Voltage (Max.) 50V AC
Current Rating (Max.) 0.5A DC
Operating Temperature Range -55C ~ +85C
Operating Humidity Range Relative humidity 90% max.
Storage Temperature Range -40C ~ +50C
Storage Humidity Range Relative humidity 90% max.
Electrical Performance
Contact Resistance 40 m Max. Mate applicable FPC/FFC and measure by dry circuit, 20mV Max, 100mA. (EIA-364-23)
Insulation Resistance 500 M Min. Mate applicable FPC/FFC and apply 500V DC between adjacent terminal or ground. (EIA-364-21)
Dielectric Strength No Breakdown Mate applicable FPC/FFC, apply 250V AC(rms) for 1 minute between adjacent terminal or ground. (EIA-364-20)
Mechanical Performance
FPC Retention Force Pos.x 0.40N Min. Insert the Latch, pull the FPC at a rate of 253mm per minute. (EIA-364-13)
Terminal Retention Force 3.0N Min. Apply axial pull out force at the rate of 253 mm/minute on the terminal assembled in the housing. (EIA-364-29)
Fitting Nail Retention Force 1.0N Min. Apply axial pull out force at the rate of 253 mm/minute on the Fitting Nail assembled in the housing. (EIA-364-29)
Environmental Performance and Others
Durability Contact Resistance: 60m Max. Insert and withdraw actuator up to 20 cycles at the speed rate of less than 10 cycles/minute. (EIA-364-09)
Temperature Rise 30C Max. Mate applicable FPC/FFC and measure the temperature rise of contact when the maximum AC rated current is passed. (EIA-364-70 Method 2)
Vibration Appearance: No Damage
Contact Resistance: 60m Max.
Discontinuity: 1sec Max.
Mate connectors and subject to vibration conditions (Amplitude: 1.5mm P-P, Frequency: 10~55~10 Hz in 1 minute, Duration: 2 hours in each of X,Y,Z axes), passing DC 100mA during the test. (EIA-364-28 Condition I)
Shock Appearance: No Damage
Contact Resistance: 60m Max.
Discontinuity: 1sec Max.
Mate applicable FPC/FFC and subject to shock conditions (Peak value: 490m/s2 {50G}), 3 times of shocks applied for each 6 directions along 3 axes, passing DC 100 mA current. (EIA-364-27, Test condition A)
Heat Resistance Appearance: No Damage
Contact Resistance: 60m Max.
Mate applicable FPC/FFC and expose to 852C for 96 hours. Condition at ambient room for 1-2 hours. (EIA-364-17)
Cold Resistance Appearance: No Damage
Contact Resistance: 60m Max.
Mate applicable FPC/FFC and expose to -402C for 96 hours. Condition at ambient room for 1-2 hours. (EIA-364-59)
Humidity Appearance: No Damage
Contact Resistance: 60m Max.
Dielectric Strength: No Breakdown
Insulation Resistance: 20 M Min.
Mate applicable FPC/FFC and expose to 40 2C, 90-95% RH for 96 hours. Condition at ambient room for 1-2 hours. (EIA-364-31)
Thermal Shock Appearance: No Damage
Contact Resistance: 60m Max.
Mate applicable FPC/FFC and subject to 5 cycles of thermal shock (-553C for 30 min, +853C for 30 min). Condition at ambient room for 1-2 hours. (EIA-364-32)
Salt Spray Appearance: No Damage
Contact Resistance: 60m Max.
Mate applicable FPC/FFC and expose to salt mist (NaCl 51%, 352C). Spray time: 244 hours (1-2u gold plating), 484 hours (3u gold plating and above). Wash with clean water and dry. (EIA-364-26)
Solderability Solder Wetting: 95% of immersed area must show no voids, pin holes. Dip conductive terminals into molten solder (2455C) up to 0.1mm from housing bottom for 30.5 seconds. (EIA-364-52)
Resistance to Soldering Heat (Soldering Iron Method) Appearance: No Damage 0.2mm from terminal tip and fitting nail tip. Soldering time: 5 seconds Max. Solder temperature: 370~400C. (EIA-364-56)

Infrared Reflow Condition

Refer to paragraph 7 for Infrared Reflow Condition. The graph indicates temperature conditions for board pattern side.

Peak Temperature: 250C MAX. (3 seconds or less)

Pre-Heat Temperature: 150C MAX.

Time above 230C: 20~40 seconds

Time above 150C: 60~90 seconds


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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