Durable 1.0mm Pitch SMT Right Angle FPC FFC ZIF Connector with K Type Latch CAX CAX-AFA07-11SCB-H2.5
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. These connectors are designed for various applications requiring reliable connections between FPC/FFC and PCBs. The series features a right-angle (R/A) mounting style with a surface-mount (SMT) termination and a K-type actuator for secure FPC/FFC retention. They are suitable for use in a wide operating temperature range of -55C to +85C and offer a maximum operating voltage of 50V AC and a current rating of 0.5A DC.
Product Attributes
- Brand: CHUANG DU ELECTRONICS
- Origin: ZHE JIANG, CHINA
- Housing Material: LCP (Natural color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Pitch: 1.0mm
- Height: 2.5mm
- Mounting Type: SMT, Right Angle (R/A)
- Actuator Type: K Type
- Packaging Options: Tube packaging (small batch), Reel packaging (bulk order recommended)
Technical Specifications
| Item | Specifications | Test Condition |
|---|---|---|
| Ratings | ||
| Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | |
| Operating Temperature Range | -55C ~ +85C | |
| Operating Humidity Range | Relative humidity 90% max. | |
| Storage Temperature Range | -40C ~ +50C | |
| Storage Humidity Range | Relative humidity 90% max. | |
| Electrical Performance | ||
| Contact Resistance | 40 m Max. | Mate applicable FPC/FFC, test voltage 20mV, current 100mA (EIA-364-23) |
| Insulation Resistance | 500 M Min. | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground (EIA-364-21) |
| Dielectric Strength | No Breakdown | Mate applicable FPC/FFC, apply 250V AC (rms) for 1 minute between adjacent terminals or ground (EIA-364-20) |
| Mechanical Performance | ||
| FPC Retention Force | Pos.x 0.40N Min. | Insert latch, pull FPC at 253mm/min (EIA-364-13) |
| Terminal Retention Force | 3.0N Min. | Apply axial pull out force on terminal at 253mm/min (EIA-364-29) |
| Fitting Nail Retention Force | 1.0N Min. | Apply axial pull out force on fitting nail at 253mm/min (EIA-364-29) |
| Environmental Performance and Others | ||
| Durability | Contact Resistance: 60m Max. | Insert and withdraw actuator up to 20 cycles at |
| Temperature Rise | 30C Max. | Measure temperature rise at contact points when max rated current passes (EIA-364-70 Method 2) |
| Vibration | Appearance: No Damage; Contact Resistance: 60m Max.; Discontinuity: 1sec Max. | DC 100mA, 1.5mm displacement, 10~55~10 Hz for 2 hours in X, Y, Z axes (EIA-364-28 Condition I) |
| Shock | Appearance: No Damage; Contact Resistance: 60m Max.; Discontinuity: 1sec Max. | DC 100mA, 3 times per axis, 490m/s {50G} (EIA-364-27, Test condition A) |
| Heat Resistance | Appearance: No Damage; Contact Resistance: 60m Max. | Expose to 852C for 96 hours, then condition at room temp 1-2 hours (EIA-364-17) |
| Cold Resistance | Appearance: No Damage; Contact Resistance: 60m Max. | Expose to -402C for 96 hours, then condition at room temp 1-2 hours (EIA-364-59) |
| Humidity | Appearance: No Damage; Contact Resistance: 60m Max.; Dielectric Strength: No Breakdown; Insulation Resistance: 20 M Min. | Expose to 402C, 90-95% RH for 96 hours, then condition at room temp 1-2 hours (EIA-364-31) |
| Thermal Shock | Appearance: No Damage; Contact Resistance: 60m Max. | 5 cycles of -553C (30min) and +853C (30min), then condition at room temp 1-2 hours (EIA-364-32) |
| Salt Spray | Appearance: No Damage; Contact Resistance: 60m Max. | 51% NaCl, 352C. 1-2u" Gold: 244 hrs; 3u"+ Gold: 484 hrs (EIA-364-26) |
| Solderability | 95% wetting area, no voids, no pinholes. | Immersion at 2455C for 30.5 seconds (EIA-364-52) |
| Resistance to Soldering Heat | Appearance: No Damage | Soldering iron method: 0.2mm from tip, 5 sec max, 370-400C (EIA-364-56) |
Infrared Reflow Condition
Refer to the provided temperature graph for infrared reflow soldering conditions. Key parameters include:
- Pre-Heat: 150C MAX. (60 sec)
- Time above 230C: 20-40 sec
- Peak Temperature: 250C MAX. (3 sec or less)
(Temperature on Board Pattern Side)
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
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Contact Person
Sellina