Flexible Printed Circuit Connector CAX CAX-C07-08SCB-H2.0 0.5mm Pitch FPC ZIF Right Angle SMT Connector
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Product Description
Product Overview
The CAX-C07-**SCB-H2.0 is a 0.5mm Pitch FPC ZIF R/A (Right Angle) SMT (Surface Mount Technology) connector series. Designed for FPC (Flexible Printed Circuit) applications, this connector offers a compact solution with a 0.5mm pitch and a height of 2.0mm. It is manufactured by Zhejiang Chuang Du Electronics Co., Ltd. and is suitable for both small batch (tube packaging) and bulk production (reel packaging).
Product Attributes
- Brand: DAET
- Manufacturer: Zhejiang Chuang Du Electronics Co., Ltd.
- Series: CAX-C07-**SCB-H2.0
- Type: FPC ZIF R/A Upper Type 3 SMT Connector
- Pitch: 0.5mm
- Height: 2.0mm
- Housing Material: LCP (Liquid Crystal Polymer)
- Housing Color: White
- Housing Flammability Rating: UL94V-0
- Actuator Material: PA6T (Polyamide 6T)
- Actuator Color: Black
- Actuator Flammability Rating: UL94V-0
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Brass
Technical Specifications
| Item | Specifications | Test Condition |
|---|---|---|
| Rating | ||
| Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.4A DC | *Including terminal temperature rise. |
| Operating Temperature Range | -25C ~ +85C | |
| Operating Humidity Range | 90% RH Max. | Relative humidity 90% max. |
| Storage Temperature Range | -10C ~ +50C | |
| Storage Humidity Range | 90% RH Max. | Relative humidity 90% max. |
| Electrical Performance | ||
| Contact Resistance | 40 m Max. | Mate applicable FPC and measure by dry circuit, 20mV Max, 10mA. (EIA-364-23) |
| Insulation Resistance | 500 M Min. | Mate applicable FPC and apply 500V DC between adjacent terminal or ground. (EIA-364-21) |
| Dielectric Strength | No Breakdown | Mate applicable FPC, apply 250V AC(rms) for 1 minute between adjacent terminal or ground. (EIA-364-20) |
| Mechanical Performance | ||
| FPC Retention Force | 0.3N Min. | Insert the actuator, pull the FPC at a rate of 253mm per minute. |
| Terminal Retention Force | 3N Min. | Apply axial pull out force at the rate of 253 mm/minute on the terminal assembled in the housing. |
| Fitting Nail Retention Force | 1N Min. | Apply axial pull out force at the rate of 253 mm/minute on the Fitting Nail assembled in the housing. |
| Environmental Performance and Others | ||
| Durability | Contact Resistance: 60m Max. | Insert and withdraw actuator up to 20 cycles at the speed rate of less than 10 cycles/minute. |
| Temperature Rise | 30C Max. | Mate applicable FPC and measure the temperature rise of contact when the maximum AC rated current is passed. (EIA-364-70 METHOD 2) |
| Vibration | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate connectors and subject to vibration conditions (1.5mm amplitude, 10-55-10 Hz, 2 hours in each of X,Y,Z axes, DC 1mA). (EIA-364-28 Condition I) |
| Shock | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate applicable FPC and subject to shock conditions (490m/s {50G}, 3 times in each of 6 directions, DC 1mA). (EIA-364-27, test condition A) |
| Heat Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC and expose to 852C for 96 hours, then condition at ambient room temperature for 1-2 hours. |
| Cold Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC and expose to -402C for 96 hours, then condition at ambient room temperature for 1-2 hours. |
| Humidity | Appearance: No Damage Contact Resistance: 60m Max. Dielectric Strength: No Breakdown Insulation Resistance: 40 M Min. | Mate applicable FPC and expose to 60 2C, 90-95% RH for 96 hours, then condition at ambient room temperature for 1-2 hours. |
| Temperature Cycling | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC and subject to 5 cycles of -553C (30 min) and +853C (30 min), then condition at ambient room temperature for 1-2 hours. |
| Salt Spray | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC and expose to 51% NaCl solution at 352C for 484 hours, then rinse with clean water and dry. |
| SO2 Gas | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC and expose to 505 ppm SO2 gas at 402C for 24 hours. |
| NH3 Gas | Appearance: No Damage Contact Resistance: 60m Max. | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. |
| Solderability | Solder Wetting: 75% of immersed area must show no voids, pinholes. Resistance to Soldering Heat: Refer to paragraph 7 for reflow; soldering iron method conditions apply. | Solder temperature 2455C, immersion depth 0.1mm from housing to solder surface, soldering time 30.5 seconds. (Soldering iron method: 0.3mm from terminal tip, 3 seconds Max., 370-400C) |
Infrared Reflow Condition
Temperature Condition Graph (Temperature on Board Pattern Side):
- Pre-Heat: 150C MAX. (60 sec)
- Soak: 60-90 sec
- Peak Temperature: 230C MIN. / 250C MAX. (20-40 sec)
- Time at Peak Temp: 3 sec. or less
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