1.0mm Pitch FPC FFC ZIF R A Type SMT Connector CAX CAX AFA07 06XCB H2.5 for Electronic Applications
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Delivery Time:
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Product Description
Product Overview
This product specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. Designed for reliable connections, these connectors are suitable for applications requiring a 1.0mm pitch and a height of 2.5mm. They are manufactured by Zhejiang Chuang Du Electronics Co., Ltd.
Product Attributes
- Brand: Zhejiang Chuang Du Electronics Co., Ltd.
- Origin: China
- Housing Material: LCP (Natural color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Packaging Options: Tube packaging (for small quantities), Reel packaging (recommended for bulk orders)
Technical Specifications
| Category | Item | Test Condition | Specification |
|---|---|---|---|
| Rating | Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | ||
| Operating Temperature Range | -55C ~ +85C | ||
| Rating | Operating Humidity Range | Relative humidity 90% max. | 90% max. |
| Storage Temperature Range | -40C ~ +50C | ||
| Rating | Storage Humidity Range | Relative humidity 90% max. | 90% max. |
| Electrical Performance | Contact Resistance | Mate applicable FPC/FFC, test voltage 20mV, current 100mA (EIA-364-23) | 40 m Max. |
| Insulation Resistance | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground (EIA-364-21) | 500 M Min. | |
| Dielectric Strength | Mate applicable FPC/FFC, apply 250V AC(rms) for 1 minute between adjacent terminals or ground (EIA-364-20) | No Breakdown | |
| Mechanical Performance | FPC Retention Force | Insert Latch, pull FPC at 253mm/min (EIA-364-13) | Pos.x 0.40N Min. |
| Terminal Retention Force | Apply axial pull out force at 253mm/min on terminal assembled in housing (EIA-364-29) | 3.0N Min. | |
| Fitting Nail Retention Force | Apply axial pull out force at 253mm/min on Fitting Nail assembled in housing (EIA-364-29) | 1.0N Min. | |
| Environmental Performance | Durability | Insert and withdraw actuator up to 20 cycles at speed rate | Contact Resistance: 60m Max. |
| Temperature Rise | Measure temperature rise of contact when maximum AC rated current is passed (EIA-364-70 Method 2) | 30C Max. | |
| Environmental Performance | Vibration | DC 100mA, 1.5mm displacement, 10~55~10 Hz for 1 min, 2 hours in each X,Y,Z axes (EIA-364-28 Condition I) | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. |
| Shock | DC 100 mA, 3 times in each of 6 directions along 3 axes, 490m/s {50G} (EIA-364-27, Test condition A) | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | |
| Heat Resistance | Expose to 852C for 96 hours, then condition at ambient for 1-2 hours (EIA-364-17) | Appearance: No Damage Contact Resistance: 60m Max. | |
| Environmental Performance | Cold Resistance | Expose to -402C for 96 hours, then condition at ambient for 1-2 hours (EIA-364-59) | Appearance: No Damage Contact Resistance: 60m Max. |
| Humidity | Expose to 402C, 90-95% RH for 96 hours, then condition at ambient for 1-2 hours (EIA-364-31) | Appearance: No Damage Contact Resistance: 60m Max. Dielectric Strength: No Breakdown Insulation Resistance: 20 M Min. | |
| Environmental Performance | Thermal Shock | 5 cycles of -553C (30 min) and +853C (30 min), then condition at ambient for 1-2 hours (EIA-364-32) | Appearance: No Damage Contact Resistance: 60m Max. |
| Salt Spray | NaCl solution 51%, 352C. 244 hrs for 1-2u gold plating; 484 hrs for 3u gold plating. Rinse and dry. (EIA-364-26) | Appearance: No Damage Contact Resistance: 60m Max. | |
| Soldering Performance | Solderability | Immersion in molten solder at 2455C, 0.1mm from housing bottom for 30.5 sec (EIA-364-52) | Solder Wetting: 95% Min. wetting area, no voids or pin holes. |
| Resistance to Soldering Heat | Soldering iron method: 0.2mm from terminal tip, 5 sec Max., 370-400C (EIA-364-56) | Appearance: No Damage |
Infrared Reflow Condition
Refer to the provided temperature curve graph for detailed IR reflow soldering parameters, including pre-heat, peak temperature, and time duration.
Temperature on Board Pattern Side:
- Pre-Heat: Max 150C
- Ramp-up: 60-90 sec
- Soak: 20-40 sec at 230C MIN.
- Peak Temperature: 250C MAX.
- Time at Peak: 3 sec or less
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
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Contact Person
Sellina