Compact 1.0mm Pitch H2.5 SMT Connectors CAX CAX AFA07 26XCB H2.5 ZIF FPC FFC Right Angle Type K Connector
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. Designed for reliable electronic connections, these connectors feature a low profile (H=2.5mm) and a right-angle (R/A) surface-mount (SMT) configuration. They are suitable for a variety of applications requiring secure and compact interconnectivity.
Product Attributes
- Brand: ZHE JIANG CHUANG DU ELECTRONICS CO.,LTD
- Origin: China
- Housing Material: LCP (Natural Color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black Color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Packaging Options: Tube (Small Batch), Reel (Bulk Order Recommended)
Technical Specifications
| Category | Item | Specifications | Test Conditions |
|---|---|---|---|
| RATING | Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | ||
| Operating Temperature Range | -55C ~ +85C | ||
| Operating Humidity Range | Relative humidity 90% max. | ||
| Storage Temperature Range | -40C ~ +50C | ||
| ELECTRICAL PERFORMANCE | Contact Resistance | 40 m Max. | Mate applicable FPC/FFC, test voltage 20mV, limit current 100mA. (EIA-364-23) |
| Insulation Resistance | 500 M Min. | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground. (EIA-364-21) | |
| Dielectric Strength | No Breakdown | Mate applicable FPC/FFC, apply 250V AC(rms) for 1 minute between adjacent terminals or ground. (EIA-364-20) | |
| MECHANICAL PERFORMANCE | FPC Retention Force | Pos.x 0.40N Min. | Insert the Latch, pull the FPC at a rate of 253mm per minute. (EIA-364-13) |
| Terminal Retention Force | 3.0N Min. | Apply axial pull out force at the rate of 253mm/minute on the terminal assembled in the housing. (EIA-364-29) | |
| Fitting Nail Retention Force | 1.0N Min. | Apply axial pull out force at the rate of 253mm/minute on the Fitting Nail assembled in the housing. (EIA-364-29) | |
| ENVIRONMENTAL PERFORMANCE AND OTHERS | Durability | Contact Resistance: 60m Max. | Insert and withdraw actuator up to 20 cycles at speed rate |
| Temperature Rise | 30C Max. | Measure the temperature rise of contact points when maximum rated current is passed through FPC/FFC. (EIA-364-70 Method 2) | |
| Vibration | Appearance: No Damage. Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Subject to vibration: 1.5mm amplitude, 10~55~10 Hz for 2 hours in X, Y, Z axes, passing DC 100mA. (EIA-364-28 Condition I) | |
| Shock | Appearance: No Damage. Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Subject to 490m/s {50G} shock for 3 times in 6 directions along 3 axes, passing DC 100mA. (EIA-364-27, Test condition A) | |
| Heat Resistance | Appearance: No Damage. Contact Resistance: 60m Max. | Expose to 852C for 96 hours, then condition at room temperature for 1-2 hours. (EIA-364-17) | |
| Cold Resistance | Appearance: No Damage. Contact Resistance: 60m Max. | Expose to -402C for 96 hours, then condition at room temperature for 1-2 hours. (EIA-364-59) | |
| Humidity | Appearance: No Damage. Contact Resistance: 60m Max. Dielectric Strength: No Breakdown. Insulation Resistance: 20 M Min. | Expose to 402C, 90-95% RH for 96 hours, then condition at room temperature for 1-2 hours. (EIA-364-31) | |
| Thermal Shock | Appearance: No Damage. Contact Resistance: 60m Max. | Subject to 5 cycles of thermal shock (-553C for 30 min, +853C for 30 min), then condition at room temperature for 1-2 hours. (EIA-364-32) | |
| Salt Spray | Appearance: No Damage. Contact Resistance: 60m Max. | Expose to 51% NaCl solution at 352C for 244 hours (1-2u gold) or 484 hours (3u+ gold), then rinse and dry. (EIA-364-26) | |
| Solderability | Solder Wetting: 95% Min. wetting area, no voids or pinholes. | Dip terminals in molten solder (2455C) for 30.5 sec, 0.1mm from housing bottom. (EIA-364-52) | |
| Resistance to Soldering Heat | Appearance: No Damage. | Soldering iron method: 370-400C, 5 sec max. (EIA-364-56) |
Infrared Reflow Condition
Refer to the temperature profile graph for recommended infrared reflow soldering conditions.
Peak Temperature: 250C MAX.
Time above 230C: 20-40 sec.
Pre-Heat Temperature: 150C MAX.
Pre-Heat Time: 60-90 sec.
Soldering Time (Peak): 3 sec. or less.
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina