1.0mm Pitch SMT FPC FFC Connector Right Angle K Type Pull Tab CAX CAX AFA07 16XCB H2.5 Surface Mount

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A (Right Angle) Type K SMT Connectors series. Designed for surface mount technology, these connectors offer a 1.0mm pitch and a height of 2.5mm, suitable for pull-tab applications. They are manufactured by Zhejiang Chuang Du Electronics Co., Ltd. and are available in tube packaging for small batches or tape and reel for bulk orders.

Product Attributes

Brand: ZHE JIANG CHUANG DU ELECTRONICS CO.,LTD
Origin: China
Housing Material: LCP (Liquid Crystal Polymer)
Housing Color: Natural
Housing Flammability Rating: UL94V-0
Latch Material: LCP (Liquid Crystal Polymer)
Latch Color: Black
Latch Flammability Rating: UL94V-0
Terminal Material: Phosphor Bronze
Fitting Nail Material: Phosphor Bronze
Connector Type: FPC/FFC Connector
Mounting Type: SMT (Surface Mount Technology)
Pitch: 1.0mm
Height: 2.5mm
Configuration: Right Angle (R/A), K Type, Pull-tab
Packaging Options: Tube (for small batches), Tape and Reel (for bulk orders)

Technical Specifications

Item	Specifications	Test Condition
Ratings
Operating Voltage (Max.)	50V AC
Current Rating (Max.)	0.5A DC
Operating Temperature Range	-55C to +85C
Operating Humidity Range	Below 90% RH
Storage Temperature Range	-40C to +50C
Storage Humidity Range	Below 90% RH
Electrical Performance
Contact Resistance	40 m Max.	Mate applicable FPC/FFC and measure by dry circuit, 20mV Max, 100mA. (EIA-364-23)
Insulation Resistance	500 M Min.	Mate applicable FPC/FFC and apply 500V DC between adjacent terminal or ground. (EIA-364-21)
Dielectric Strength	No Breakdown	Mate applicable FPC/FFC, apply 250V AC (rms) for 1 minute between adjacent terminal or ground. (EIA-364-20)
Mechanical Performance
FPC Retention Force	Pos. x 0.40N Min.	Insert the Latch, pull the FPC at a rate of 253mm per minute. (EIA-364-13)
Terminal Retention Force	3.0N Min.	Apply axial pull out force at the rate of 253 mm/minute on the terminal assembled in the housing. (EIA-364-29)
Fitting Nail Retention Force	1.0N Min.	Apply axial pull out force at the rate of 253 mm/minute on the Fitting Nail assembled in the housing. (EIA-364-29)
Environmental Performance and Others
Durability	Contact Resistance: 60m Max.	Insert and withdraw actuator up to 20 cycles at the speed rate of less than 10 cycles/minute. (EIA-364-09)
Temperature Rise	30C Max.	Mate applicable FPC/FFC and measure the temperature rise of contact when the maximum AC rated current is passed. (EIA-364-70 Method 2)
Vibration	Contact Resistance: 60m Max. Discontinuity: 1sec Max.	Mate connectors and subject to vibration conditions (Amplitude: 1.5mm P-P, Frequency: 10~55~10 Hz in 1 minute, Duration: 2 hours in each of 3 mutually perpendicular axes), passing DC 100mA. (EIA-364-28 Condition I)
Shock	Contact Resistance: 60m Max. Discontinuity: 1sec Max.	Mate applicable FPC/FFC and subject to shock conditions (Peak value: 490m/s {50G}), 3 times for each of 6 directions along 3 axes, passing DC 100mA. (EIA-364-27, Test condition A)
Heat Resistance	Contact Resistance: 60m Max.	Mate applicable FPC/FFC and expose to 852C for 96 hours, then condition at ambient room conditions for 1-2 hours. (EIA-364-17)
Cold Resistance	Contact Resistance: 60m Max.	Mate applicable FPC/FFC and expose to -402C for 96 hours, then condition at ambient room conditions for 1-2 hours. (EIA-364-59)
Humidity	Contact Resistance: 60m Max. Dielectric Strength: No Breakdown Insulation Resistance: 20 M Min.	Mate applicable FPC/FFC and expose to 40 2C, 90-95% RH for 96 hours, then condition at ambient room conditions for 1-2 hours. (EIA-364-31)
Thermal Shock	Contact Resistance: 60m Max.	Mate applicable FPC/FFC and subject to 5 cycles of thermal shock (-553C for 30 min, +853C for 30 min), then condition at ambient room conditions for 1-2 hours. (EIA-364-32)
Salt Spray	Contact Resistance: 60m Max.	Mate applicable FPC/FFC and expose to salt mist (51% NaCl, 352C). Spray time: 244 hours (1-2u gold plating), 484 hours (3u+ gold plating). Rinse with water and dry. (EIA-364-26)
Solderability	Solder Wetting: 95% Min. wetting area, no voids or pinholes.	Dip conductive terminals into molten solder (2455C) up to 0.1mm from housing bottom for 30.5 seconds. (EIA-364-52)
Resistance to Soldering Heat	Appearance: No damage.	Soldering iron method: 0.2mm from terminal tip, 370-400C, 5 seconds Max. (EIA-364-56)
Infrared Reflow Condition
Temperature Profile	Peak Temp: 250C Max. (3 sec. or less) Pre-Heat Max: 150C Time at 230C Min.: 20-40 sec. Soak Time (60-90 sec.)	(Temperature on Board Pattern Side)