1.0mm Pitch SMT Connector CAX CAX-AFA07-26SCB-H2.5 Featuring Surface Mount Style and Black LCP Latch
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. These connectors are designed for various applications requiring a compact and reliable connection solution. They feature a LCP housing in natural color and a black LCP latch, both with a UL94V-0 flammability rating. The terminals and fitting nails are made of Phosphor Bronze.
Product Attributes
- Brand: CHUANG DU ELECTRONICS
- Origin: ZHE JIANG
- Housing Material: LCP (Natural Color, UL94V-0)
- Latch Material: LCP (Black, UL94V-0)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Pitch: 1.0mm
- Height: 2.5mm
- Type: SMT, Right Angle (R/A), K Type, Pull Tab
- Mounting Style: Surface Mount (SMT)
- Packaging Options: Tube (for small quantities), Reel (recommended for bulk)
Technical Specifications
| Item | Specifications | Test Condition |
|---|---|---|
| Ratings | ||
| Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | |
| Operating Temperature Range | -55C to +85C | |
| Operating Humidity Range | Relative humidity 90% max. | |
| Storage Temperature Range | -40C to +50C | |
| Storage Humidity Range | Relative humidity 90% max. | |
| Electrical Performance | ||
| Contact Resistance | 40 m Max. | Mate applicable FPC/FFC, test voltage 20mV, current 100mA (EIA-364-23) |
| Insulation Resistance | 500 M Min. | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground (EIA-364-21) |
| Dielectric Strength | No Breakdown | Mate applicable FPC/FFC, apply 250V AC (rms) for 1 minute between adjacent terminals or ground (EIA-364-20) |
| Mechanical Performance | ||
| FPC Retention Force | Pos. x 0.40N Min. | Insert Latch, pull FPC at 253mm/min (EIA-364-13) |
| Terminal Retention Force | 3.0N Min. | Apply axial pull out force at 253mm/min on terminal in housing (EIA-364-29) |
| Fitting Nail Retention Force | 1.0N Min. | Apply axial pull out force at 253mm/min on fitting nail in housing (EIA-364-29) |
| Environmental Performance and Others | ||
| Durability | Contact Resistance: 60m Max. | Insert and withdraw actuator up to 20 cycles at |
| Temperature Rise | 30C Max. | Measure temperature rise at contact point when maximum rated current is passed (EIA-364-70 Method 2) |
| Vibration | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate connectors, subject to 1.5mm P-P amplitude, 10~55~10 Hz, 2 hours in each of X,Y,Z axes, passing DC 100mA (EIA-364-28 Condition I) |
| Shock | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate applicable FPC/FFC, apply 490m/s {50G} shock 3 times in each of 6 directions along 3 axes, passing DC 100mA (EIA-364-27, Test condition A) |
| Heat Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to 852C for 96 hours, then condition at room temp 1-2 hours (EIA-364-17) |
| Cold Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to -402C for 96 hours, then condition at room temp 1-2 hours (EIA-364-59) |
| Humidity | Appearance: No Damage Contact Resistance: 60m Max. Dielectric Strength: No Breakdown Insulation Resistance: 20 M Min. | Mate applicable FPC/FFC, expose to 402C, 90-95% RH for 96 hours, then condition at room temp 1-2 hours (EIA-364-31) |
| Thermal Shock | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, subject to 5 cycles of -553C (30min) and +853C (30min), then condition at room temp 1-2 hours (EIA-364-32) |
| Salt Spray | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to 51% NaCl solution at 352C for 244 hours (1-2u" gold) or 484 hours (3u"+ gold), then wash and dry (EIA-364-26) |
| Solderability | 95% wetting area, no voids or pinholes. | Dip conductive terminals into molten solder at 2455C for 30.5 seconds, 0.1mm from housing bottom (EIA-364-52) |
| Resistance to Soldering Heat | Appearance: No Damage | Soldering iron method: 0.2mm from terminal/nail tip, 5 seconds max, 370-400C (EIA-364-56) |
Infrared Reflow Condition
Refer to paragraph 7 for infrared reflow temperature profile. Key parameters include:
- Pre-Heat: 150C MAX.
- Time at 230C MIN: 20-40 sec.
- Peak Temperature (250C MAX.): 3 sec. or less
(Temperature graph details are visual and not fully representable in text format)
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina