industrial connector chxunda XD-5557-PT 4.20mm pitch designed for consistent electrical performance

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Product Description

Product Overview

The 4.20mm pitch 5557 connector series offers reliable connection solutions designed for various industrial applications. These connectors are built to meet stringent performance standards, ensuring durability and consistent electrical performance. They are suitable for use in environments with temperatures ranging from -25 to +85 and are designed for compatibility with specific wire gauges and PCB thicknesses.

Product Attributes

  • Brand: XunDa ()
  • Series: 5557 (4.20mm Pitch)
  • Origin: Shenzhen, China
  • Certifications: UL94V-0 (for Housing Material)
  • RoHS Compliant: Yes

Technical Specifications

Category Specification Details
General Pitch 4.20 mm
Connector Type WTB DIP CONN, Single Row
Part Number Prefix XD-5557
Use Condition Ambient Temperature Range -25 to +85
Applicable Wire Sizes AWG #16 to #28
Applicable PC Board Thickness 1.6mm
Material & Finish Terminal Contact Material Phosphor Bronze / Brass
Plating Tin plating: 24m
Housing Material Type Nylon66 UL94V-0(2)
Color Transparent (Default)
Types Housing (Y), Female Housing (EY)
Types Wafer (A - Straight Pin, AW - Right Angle Pin, AWD - Right Angle with Screw)
Electrical Performance Rated Voltage 300V AC/DC
Rated Current 9A AC/DC
Contact Resistance Initial value 20m (Max 40m after tests)
Insulation Resistance 1000 M
Withstand Voltage 1500V AC (rms) for 1 minute (between adjacent contacts)
Mechanical Performance Single Contact Insertion Force 2N
Single Contact Withdrawal Force 20N (for AWG #16) to 13N (for AWG #28)
Pin Retention Force 30N (per contact)
Terminal Crimping Wire Strength 90N (for AWG #16) to 30N (for AWG #28)
Durability 30 cycles
Environmental Performance High Temperature Aging 852 for 96 hours
Temperature Cycling -55 to +85 (5 cycles)
Constant Humidity 402, 90-95% RH for 96 hours
Salt Spray 353, 51% NaCl solution for 8 hours (after plating) or 48 hours (before plating)
Soldering Solderability Tin plating area 90% at 2455C for 30.5S
Resistance to Soldering Heat (Manual) 3505C for 30.5S
Resistance to Soldering Heat (Reflow) 2555C for 20S Max. (Refer to SMT lead-free process temperature curve)
Packaging Storage Temperature -20 to +40, 80% RH
Transportation Transport Temperature -20 to +50

Model Information

Single Row Connectors (XD-5557 Series)

  • Housing (Y): XD-5557-NY-X
  • Female Housing (EY): XD-5557-NEY-X
  • Straight Pin (A): XD-5557-NA-X-XX
  • Right Angle Pin (AW): XD-5557-NAW-X-XX
  • Right Angle with Screw (AWD): XD-5557-NAWD-X-XX

Note: 'X' in part numbers denotes the number of circuits. Additional suffixes may indicate color or plating options.

Ordering Information Example (Single Row Housing):

XD-5557-NY-X

  • XD-5557: Series
  • N: Nylon66 UL94-VO(2)
  • Y: Housing
  • X: Number of Circuits (e.g., 2, 3, 4...12)
  • Optional Suffixes: Color (R=Red, L=Blue, B=Black, Y=Yellow, P=Purple, V=Green)

Ordering Information Example (Single Row Straight Pin):

XD-5557-NA-X-XX

  • XD-5557: Series
  • N: Wafer Nylon66 UL94-VO(2)
  • A: Straight Pin
  • X: Number of Circuits (e.g., 2, 3, 4...12)
  • Optional Suffixes: Color (R=Red, L=Blue, B=Black, Y=Yellow, P=Purple, V=Green)
  • Contact Plating: (Default: Tin, G1:1u" Gold, G2:2u" Gold, G3:3u" Gold, G4:4u" Gold, G5:5u" Gold)

Caution

Plastic components, due to their water absorption characteristics, should be protected from environments with temperatures higher than 30 and humidity above 60% RH after the package is opened. Ensure all components are used within 24 hours of opening to prevent foaming or deformation during reflow or wave soldering processes.


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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