Double Row Connector chxunda XD-43030-T 3 Millimeter Pitch Suitable for SMT and DIP Electrical Assemblies
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The 3.00mm Pitch 43045/43025 Series Double Row Connector is designed for reliable electrical connections in various applications. This series offers a pitch of 3.00 mm and is available in SMT and DIP configurations. It is engineered to meet stringent performance, testing, and inspection requirements, ensuring interchangeability with components of the same specification. The connectors are suitable for use in a wide ambient temperature range and are designed to accommodate specific wire gauges and PCB thicknesses.
Product Attributes
- Brand: Shenzhen XunDa Technology Co., Ltd.
- Series: 43045/43025 (3.00mm Pitch)
- Type: Double Row, WTB SMT / DIP Connector
- Certifications: RoHS
- Housing Material: Nylon66 UL94V-0 (Color: Black)
- Contact Material: Brass with Tin plating (0.45mm or 0.64mm thickness) or Phosphor bronze (0.2mm thickness)
- Wafer Material: LCP UL94V-0 (Color: Black)
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General | Pitch | 3.00 mm |
| Applicable Standards | GB/T2421, GB/T2423, GB/T2424, GB/T5095 | |
| Applicable Wire Sizes | AWG #20#28 | |
| Operating Conditions | Ambient Temperature Range | -25 to +85 |
| Applicable PC Board Thickness | 1.6mm | |
| Electrical Performance | Rated Voltage | 250V AC, DC |
| Rated Current | 5A AC, DC | |
| Contact Resistance | 20m (Initial) | |
| Insulation Resistance | 1000 M | |
| Mechanical Performance | Terminal Crimping Wire Pullout Force | 30N (AWG#20), 20N (AWG#22), 13N (AWG#24) |
| Single Contact Withdrawal Force | 2N | |
| Durability | 30 cycles (10 cycles/min) | |
| Environmental Performance | Thermal Aging | 96 hours at 852 |
| Humidity Test | 96 hours at 402, 90-95% RH | |
| Salt Spray Test | 353, 51% solution (Stamping after tin plated for 8 hours / Stamping before tin plated for 48 hours) | |
| Soldering Performance | Solder Ability | 2455 for 30.5S (90% solder area) |
| Resistance to Soldering Heat (DIP) | 3505 for 30.5S | |
| Resistance to Soldering Heat (SMT Reflow) | 2555 for 20S Max. | |
| Packaging & Storage | Transportation Temperature | -20 to +50 |
| Storage Temperature | -20 to +40 (Relative Humidity 80%) | |
| Storage Duration | 6 months (Re-qualification test required after 6 months) |
Product Models
| Part Number Base | Type | Description | Circuit Options |
|---|---|---|---|
| XD-43045-2xN | A (Straight Pin) | Double Row Wafer | 1 to 12 Circuits |
| XD-43045-2xN | AW (Right Angle Pin) | Double Row Wafer | 1 to 12 Circuits |
| XD-43045-2xN | ALT (Vertical Mount) | Double Row Wafer | 1 to 12 Circuits |
| XD-43045-2xN | AWT (Horizontal Mount) | Double Row Wafer | 1 to 12 Circuits |
| XD-43025-2xNY | Y (Female Housing) | Double Row Housing | 2 to 12 Circuits |
| XD-43020-2xNEY | EY (Male Housing) | Double Row Housing | 2 to 12 Circuits |
| XD-43030-T | Terminal | Contact Terminal | N/A |
| XD-43031-PT | Terminal | Plug Terminal | N/A |
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