Durable Electrical Connector chxunda XD-TJC3B-H-T 2.50mm Pitch Suitable for AWG 22 to 28 Wire Gauges
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The TJC3B-H series 2.50mm pitch connectors are designed for reliable electrical connections in various applications. These connectors offer a robust solution with specific material compositions and plating options to ensure durability and performance. They are suitable for wire gauges from AWG #22 to #28 and are compatible with 1.6mm thick PC boards. The series includes single-row housing, terminals, and straight pin headers, catering to different assembly needs.
Product Attributes
- Brand: Shenzhen XunDa Technology Co., Ltd.
- Series: TJC3B-H
- Pitch: 2.50 mm
- Housing Material: Nylon66 UL94V-0 (Nature/White)
- Terminal Material: Phosphor bronze
- Terminal Plating: Tin plating (2-4m)
- Pin Material: Brass
- Pin Plating: Tin plating (2-4m)
- Certifications: UL94V-0
- RoHS Compliant: Yes
Technical Specifications
| Specification | Details |
|---|---|
| Product Type | 2.50mm Pitch TJC3B-H Connector (Single Row) |
| Part Number Prefix | XD-TJC3B-H |
| Rated Voltage | 250V AC, DC |
| Rated Current | 3A AC, DC |
| Ambient Temperature Range | -25 to +85 |
| Applicable Wire Sizes | AWG #22 to #28 |
| Applicable PC Board Thickness | 1.6mm |
| Contact Resistance (Max) | 20m (Initial value) |
| Insulation Resistance (Min) | 1000M |
| Withstanding Voltage | 1000V AC/minute (No breakdown or flashover) |
| Terminal Crimping Wire Strength (AWG #22) | 30N |
| Single Contact Withdrawal Force | 10N |
| Fixed Terminals and Hole Seat Force | 50N |
| Single Contact Insertion Force | 5.5N |
| Pin Retention Force | 1.5N |
| Pin Withdrawal Force | 10N |
| Durability Cycles | 30 cycles |
| Vibration Test Contact Resistance | 40m |
| High Temperature Aging Test Contact Resistance | 40m |
| Constant Humidity Test Contact Resistance | 40m |
| Temperature Cycling Test Contact Resistance | 40m |
| Salt Spray Test Contact Resistance | 40m |
| Solder Ability (Wave Soldering) | 90% solder area |
| Resistance to Soldering Heat (DIP) | Soldering time: 30.5S, Pot temp: 3505 |
| Resistance to Soldering Heat (Wave) | Soldering time: 50.5S, Pot temp: 2605 |
| Resistance to Soldering Heat (Reflow) | Soldering time: 20S Max, Pot temp: 2555 |
| Storage Temperature | -20 to +40 |
| Transportation Temperature | -20 to +50 |
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