Electrical Connectors 420mm Pitch chxunda XD-5557-T Series 5557 Featuring Straight and Right Angle Pins
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The 4.20mm pitch 5557 series connectors are designed for reliable electrical connections. These connectors are suitable for a wide range of applications, offering durable performance and adherence to international testing standards. They are available in various configurations including single row housings, male terminals, female housings, straight pins, and right-angle pins, catering to diverse assembly needs.
Product Attributes
- Brand: XunDa ()
- Origin: Shenzhen, China
- Series: 5557 (4.20 mm)
- Housing Material: Nylon66 UL94V-0 (2)
- Contact Material: Phosphor bronze or Brass
- Plating: Tin plating (2-4m)
- Color Options (Housing): Transparent (default), Red, Blue, Black, Yellow, Purple, Green
- Certifications: RoHS
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General | Pitch | 4.20 mm |
| Series Type | WTB DIP CONN Single Row | |
| Applicable Standards | GB/T2421, GB/T2423, GB/T2424, GB/T5095 | |
| Interchangeability | Exchangeable with same specification products | |
| Use Condition | Ambient Temperature Range | -25 to +85 |
| Applicable Wire Sizes | AWG #16 to #28 | |
| Applicable PC Board Thickness | 1.6mm | |
| Electrical Performance | Rated Voltage | 300V AC/DC |
| Rated Current | 9A AC/DC | |
| Contact Resistance | Initial value 20m (Max 40m after tests) | |
| Insulation Resistance | 1000 M | |
| Withstand Voltage | 1500V AC (rms) for 1 minute (leakage current | |
| Mechanical Performance | Single Contact Insertion Force | 2N |
| Single Contact Withdrawal Force | 20N (for AWG #28) to 90N (for AWG #16) | |
| Terminal Crimping Wire Strength | 30N (for AWG #28) to 110N (for AWG #16) | |
| Pin Retention Force | 30N | |
| Durability | 30 cycles (max 10 cycles/minute) | |
| Environmental Performance | Thermal Aging | 96 hours at 852 |
| Temperature Rise | Measured at maximum rated current | |
| Constant Humidity | 96 hours at 402, 90-95% RH | |
| Temperature Cycling | 5 cycles (-553 for 30min to 853 for 30min) | |
| Salt Spray | 5% NaCl solution, 353, 48 hours (pre-plated) or 8 hours (post-stamped) | |
| Solderability | Tin plating: 2455 for 30.5s; Wave soldering: 2605 for 50.5s; Reflow soldering: 2555 for 20s Max. | |
| Packaging, Transportation & Storage | Packaging | Disc loading material for terminals, plastic shell packaging, packed with certificate. Exterior carton with packing list. Product must not rock in the box. |
| Transportation Temperature | -20 to +50 | |
| Storage Conditions | -20 to +40, 80% RH, no corrosive gases. Re-qualification test required if stored over 6 months. | |
| Models & Dimensions | Part No. Prefix | XD-5557- |
| Housing Type | NY (Male Housing), NEY (Female Housing) | |
| Pin Type | T (Terminal), PT (Male Terminal), A (Straight Pin), AW (Right-Angle Pin), AWD (Locating Right-Angle Pin) | |
| Circuit Count | 2 to 12 positions | |
| Example Part Numbers | XD-5557-2Y-X (2-pin Male Housing), XD-5557-3EY-X (3-pin Female Housing), XD-5557-2A-X-XX (2-pin Straight Pin), XD-5557-3AW-X-XX (3-pin Right-Angle Pin), XD-5557-2AWD-X-XX (2-pin Locating Right-Angle Pin) | |
| Dimensions (A, B) | Varies by circuit count (e.g., 2-pin: A=9.60mm, B=8.40mm; 12-pin: A=51.60mm, B=46.20mm) | |
| Terminal Material | Phosphoric brass, Tin plating: 2-4m | |
| Housing Material | Nylon66 UL94-V-0 (2), Color: Transparent | |
| Wafer Material | Nylon66 UL94-V-0 (2), Color: Transparent | |
| Contact Plating Options | Tin (default), G1 (1" Gold), G2 (2" Gold), G3 (3" Gold), G4 (4" Gold), G5 (5" Gold) | |
| Ordering Information (Housing) | XD-5557-N***-* (e.g., XD-5557-NY-X for Male Housing, XD-5557-NEY-X for Female Housing) | |
| Ordering Information (Pin) | XD-5557-N***-*-** (e.g., XD-5557-NA-X-XX for Straight Pin, XD-5557-NAW-X-XX for Right-Angle Pin) |
Caution: Plastic parts are hygroscopic. Avoid exposure to temperatures >30 and humidity >60% RH after opening packaging. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering.
Reflow Temperature Curve: Refer to SMT lead-free process temperature curve (Section 9.1).
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