6.50mm Pitch Double Row Connector chxunda XD-VYH-T for Robust Interconnections in Demanding Environments
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The 6.50MM Pitch VYH Connector Double Row Type, manufactured by Shenzhen Xunda Technology Co., Ltd., is designed for various electrical applications. This connector series offers reliable performance with specifications including a 10A AC/DC current rating and a 300V AC/DC voltage rating. It operates within a temperature range of -40 to +105 and is constructed from durable materials like Nylon66 UL94-V0 and brass with tin plating. Suitable for PC board thickness of 1.6mm and applicable wire sizes from AWG #16 to #26, these connectors are engineered for robust interconnections in demanding environments.Product Attributes
- Brand: Shenzhen Xunda Technology Co., Ltd.
- Product Series: VYH (6.50)
- Type: Single/Double Row SMT Connector
- Housing Material: Nylon66 UL94-V0
- Contact Material: Brass / Copper Alloy
- Contact Plating: Tin plating
- Housing Color: White (default)
- Certifications: ROHS
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | 6.50MM Pitch VYH Connector Double Row Type |
| Part Number Prefix | XD-VYH |
| Pitch | 6.50 mm |
| Current Rating | 10A AC, DC |
| Voltage Rating | 300V AC, DC |
| Temperature Range | -40 ~ +105 |
| Contact Resistance (Initial) | 20m |
| Contact Resistance (After Test) | 40m |
| Insulation Resistance | 1000 M |
| Withstanding Voltage | 1500V AC/minute (leakage current 0.5mA) |
| Applicable PC Board Thickness | 1.6mm |
| Applicable Wire Sizes | AWG #16 ~ #26 |
| Terminal Contact Material | Copper Alloy (0.25mm thick) |
| Terminal Contact Plating | Tin plating: 3~5m |
| Housing Material | Nylon66 UL94-V0 |
| Housing Color | White |
| Pin Retention Force (per contact) | 20N |
| Terminal Crimping Wire Strength (per contact) | 130N (AWG #16) |
| Terminal Crimping Wire Strength (per contact) | 90N (AWG #18) |
| Terminal Crimping Wire Strength (per contact) | 70N (AWG #20) |
| Durability | 30 cycles |
| Thermal Aging Temperature | 852 |
| Thermal Aging Period | 96 hours |
| Constant Humidity Temperature | 402 |
| Constant Humidity Relative Humidity | 90-95% RH |
| Constant Humidity Period | 96 hours |
| Temperature Cycling Low Temp | -553C for 30 min |
| Temperature Cycling High Temp | 853C for 30 min |
| Temperature Cycling Total Cycles | 5 cycles |
| Salt Spray Temperature | 353C |
| Salt Spray Solution | 51% |
| Salt Spray Period (after plating) | 8 hours |
| Salt Spray Period (before plating) | 48 hours |
| Solder Ability Temperature | 2455C |
| Solder Ability Immersion Period | 3 0.5S |
| Solder Ability Soldering Area | 90% |
| Resistance to Soldering Heat (Manual) | Soldering Time: 30.5S, Soldering Pot: 3505 |
| Resistance to Soldering Heat (Wave) | Soldering Time: 50.5S, Soldering Pot: 2605 |
| Resistance to Soldering Heat (Reflow) | Soldering Time: 20S Max, Soldering Pot: 2555C |
| Storage Temperature | -20 ~ +40 |
| Storage Humidity | 80% RH |
| Transportation Temperature | -20 ~ +50 |
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