High Reliability DDR4 SO DIMM Connector 260 Pin Compact 9.2mm Height FOXCONN ASAA823-EARB0-7H for SMT Applications
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Product Description
Product Overview
This DDR4 SO DIMM connector is designed for high-performance memory modules, offering a reliable interface for memory expansion in computing systems. It features a 260-pin configuration and a compact 9.2mm height, making it suitable for space-constrained applications. The connector supports various gold plating options for enhanced conductivity and durability, and is manufactured with halogen-free and lead-free materials, aligning with environmental standards. It is designed for SMT (Surface Mount Technology) processes with a recommended peak temperature of 260C.
Product Attributes
- Brand: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Type: DDR4 SO DIMM Connector
- Color: Black
- Material (Housing): LCP SV6808THF UL94V-0, Halogen Free
- Material (Contact): Phosphor Bronze C5210
- Material (Metal Pad): Stainless Steel SUS 301
- Certifications: Halogen Free & Lead Free
- Origin: Designed and manufactured by Foxconn Interconnect Technology Limited
Technical Specifications
| Specification | Details |
|---|---|
| Part Number (Base) | ASAA82*-EARB0-*H |
| Number of Positions | 260 Pin |
| Memory Type | DDR4 SODIMM |
| Height | 9.2mm |
| Pitch | 0.80mm |
| Contact Plating Options | Gold Flash, 5u" Gold Plating, 10u" Gold Plating, 15u" Gold Plating, 30u" Gold Plating |
| Contact Resistance | 60 m Max. (Initial), 10 m Max. (After environmental testing) |
| Current Rating | 0.5 Ampere Max. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms Min. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Durability | 60 Mating Cycles |
| Operating Temperature | -55C to +85C |
| SMT Peak Temperature | 260C for 10-20s |
| Packaging Options | Soft Tray, Tape & Reel |
| Dimensions (Overall Length) | 78.0mm Max. (Latch Open) |
| Dimensions (Width) | 72.1mm |
| Dimensions (PCB Layout Thickness) | 1.40mm (Recommended) |
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