foxconn as0a826 h2sb 7h 260 pin ddr4 so dimm connector with black color and multiple plating options
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Product Description
Product Overview
This document details the Foxconn Interconnect Technology Limited AS0A82*-H2SB-7H, a 260-pin SO DIMM connector designed for DDR4 memory modules. It features a standard 5.2mm height and is suitable for SMT processes with a peak temperature of 260C for 10-20 seconds. The connector is built for durability with 60 mating cycles and operates within a temperature range of -55C to +85C. It is constructed with a thermoplastic UL94V-0 housing and copper alloy contacts with various plating options, including gold flash and up to 30" gold plating at the contact area.
Product Attributes
- Brand: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Product Line: DDR4 SO DIMM Connector
- Part Number: AS0A82*-H2SB-7H
- Housing Material: Thermoplastic UL94V-0, Halogen Free, Black Color
- Contact Material: Copper Alloy
- Contact Plating Options: Gold Flash, 5" Gold, 10" Gold, 15" Gold, 30" Gold
- Underplating: 50" Nickel (Contact Area), 10" Nickel (Tail)
- Solder Pad Material: Stainless Steel
- Solder Pad Plating: 100" Matte Tin Plating
- Color: Black
- Certifications: UL94V-0, Halogen Free
- Date Code: 2013/10/11
Technical Specifications
| Specification | Value |
|---|---|
| Number of Positions | 260 Pins |
| Connector Type | DDR4 SO DIMM |
| Standard | DDR4 STD |
| Height | 5.2 mm |
| Contact Current Rating | 0.5 Ampere MAX. per pin |
| Voltage Rating | 25V AC |
| Insulation Resistance | 100 Megaohms MIN. at 500V DC |
| Dielectric Withstanding Voltage | 250V AC RMS at 60Hz, for 1 minute |
| Contact Resistance (Initial) | 60 Milliohms MAX. per pin |
| Contact Resistance (After Environmental Testing) | 10 Milliohms MAX. per pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -55C to +85C |
| SMT Peak Temperature | 260C (10~20 seconds) |
| Overall Width | 72.1 mm |
| Overall Height | 65.7 0.5 mm |
| Slot Width | 70.00 0.15 mm |
| PCB Layout Thickness (Recommended) | 1.40 mm |
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