Brass Base and Tin Plated Contacts Hanbo Electronic WAFER-XH254JK-3A with White LCP PA66 Housing UL94V0
Product Overview
This product features a brass base/wafer with tin plating, offering a minimum of 30" nickel plating and a minimum of 80" re-tinning. The housing is constructed from white LCP/PA66 (UL94V-0). It is designed with specific technical parameters including pitch, temperature range, rated voltage, rated current, contact resistance, insulation resistance, and withstand voltage. The plastic housing is designed for a smooth surface finish, free from burrs, shrinkage, defects, or cracks. The locking window configuration is specified, and variations in extraction force due to different mating positions are considered normal.
Product Attributes
- Base/Wafer Material: Brass
- Plating: Tin plating (entire surface with underlying nickel plating)
- Re-tinning: 80" MIN
- Housing Material: White LCP/PA66 (UL94V-0)
- Housing Color: Natural
- Contact Material: Brass
- Contact Plating: Tin plating (entire surface with underlying nickel plating)
- Contact Re-tinning: 80" MIN
Technical Specifications
| Specification | Value |
|---|---|
| Pitch | [Not Specified] |
| Temperature Range | ~ |
| Rated Voltage | [Not Specified] |
| Rated Current | [Not Specified] |
| Contact Resistance | |
| Insulation Resistance | |
| Withstand Voltage | [Not Specified] |
| Locking Window Configuration | ~ for X pcs, for Y pcs |
Note on Housing: Plastic housing surfaces should be smooth, free from burrs, obvious shrinkage, defects, cracks, etc.
Note on Mating: Variations in extraction force due to different mating positions are normal.
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