SMT Type Micro Coaxial RF Receptacle FG IF-0203 for Mobile Phones Wireless Nets and GPS Applications
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
This SMT Type Micro Coaxial RF Receptacle, part name USS RF REC, is designed as a micro strip-to-Coaxial adapter for RF circuits. It is suitable for applications including Mobile Phones, Wireless Nets, Mini PCI, Bluetooth, PDAs, GPS, and Electric Measurement Instruments. The product is designed for intermateability with industry-standard products of the opposite gender.
Product Attributes
- Brand: Fu Gang ()
- Origin: Shenzhen, China ()
- Product Type: SMT Type Micro Coaxial RF Receptacle
- Part Name: USS RF REC
Technical Specifications
| Specification | Value |
|---|---|
| Rated Voltage | 60VAC (R.M.S) |
| Frequency Range | 0~6GHz |
| Characteristic Impedance | 50 |
| Operating Temperature | -40~90 |
| Operating Humidity | 90% MAX |
| Dielectric Resistance | 500M (Initial), 100 M MIN (After testing) |
| Dielectric Withstand Voltage | 200VAC for 1 minute |
| Contact Resistance (Signal) | 20m max (Initial) |
| Contact Resistance (Ground) | 20m max (Initial) |
| VSWR (0.1~3GHz) | 1.3 max |
| VSWR (3~6GHz) | 1.4 max |
| Un-mating Force (Initial) | 4N MIN |
| Un-mating Force (After 30 cycles) | 2N MIN |
| Crimp Strength | 8N MIN |
| Durability | 30 cycles |
| Vibration | Frequency: 10Hz 100 Hz 10Hz/approx 20 minutes; Half amplitude, Peak value of acceleration: 1.5mm or 59m/s(6G) |
| Shock | Peak value of acceleration: 735 m/s(75G); Duration: 11msec; Wave Form: half sinusoidal |
| Humidity (Steady State) | Temperature: 402; Humidity: 9095%RH; Duration: 96 hours |
| Thermal Shock | -55 85; Transition time: 5min. MAX; No. of cycles: 5 cycles |
| High Temperature Life | Temperature: 902; Duration: 96 hours |
| H2S Gas | Temperature: 402; Relative Humidity: 805%RH; Duration: 96 hours |
| Salt Water Spray | Temperature: 352; Relative Humidity: 9598%RH; Salt water density: 51%(by weight); Duration: 96 hours |
| Solderability | Dip solder tine in solder bath at 2455 for 50.5seconds. More than 95% of dipped surface shall be wet. |
| Reflow Soldering | Peak: 260+0/-5 (Max), 225 MIN (70 sec MIN); Pre-heat: 160170 (80100 sec) |
| Number of Reflow | Within 2 times |
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