| Product Description | Space saving design, low height (0.9 mm), horizontal mating, single row connector. |
| High-Speed Transmission Support | eDP Ver. 1.3 compatible (5.4 Gbps), MIPI (D-PHY) |
| Shielding | Enhanced shielding with multiple grounding points. |
| Locking Mechanism | Positive locking structure with rotary latch to prevent incomplete mating. |
| Mating Operation | Excellent self-alignment for easier mating (X direction: 0.45, Z direction: 0.15). |
| Cable Compatibility | Accepts both micro coaxial cable and discrete wire. |
| Solder Wicking Prevention | Nickel barriers between contact area and soldered lead area. |
| Rated Current [Discrete wire] | AWG #34: 0.3 A (MAX 0.8 A), AWG #36: 0.3 A (MAX 0.8 A) |
| Rated Current [Micro coaxial cable] | AWG #36: 0.3 A (MAX 0.8 A), AWG #40: 0.25 A, AWG #42: 0.2 A, AWG #44: 0.15 A, AWG #46: 0.1 A |
| Operating Temperature Range | -35 to 85C |
| Operating Humidity Range | 20 to 80% |
| Rated Voltage | 100 V AC/DC |
| Storage Temperature Range | -10 to 60C |
| Storage Humidity Range | 40 to 70% |
| Insulation Resistance | 50 M or greater (at 100 V DC) |
| Withstanding Voltage | 250 V AC for one minute (no flashover or breakdown) |
| Contact Resistance | Signal: 80 m or lower, GND: 80 m or lower (at 100 mA) |
| Vibration Resistance | No electric outage of 1s or greater (10 cycles in each of three directions at 10-55 Hz, single amplitude 0.75 mm) |
| Moisture Resistance | Contact resistance change: 50 m or lower; Insulation resistance: 25 M or greater (402C, 90 to 95% humidity, 96 hours) |
| Temperature Cycles | Contact resistance change: 50 m or lower; Insulation resistance: 25 M or greater (5 cycles of -55C to 85C) |
| Mating Cycles | Contact resistance change: 50 m or lower (30 cycles) |
| Solder Heat Resistance | No dissolution of resin part influencing performance (Reflow or Hand soldering: 350C for 3 seconds) |
| Product Number Structure | Series Name (DF) - No. (81/81D) - Numbers of Contacts (30, 40, 50) - Connector type (S: Receptacle, P: Plug) - Contact pitch (0.4mm) - Termination Type (H: Right Angle SMT, SD: Solder wire termination) - Packaging Type ((51): Embossed packaging) - Parts for Assembly (SHL: Outer shell, LCH: Latch) |
| Models & Dimensions (Receptacle SMT) | | Product No. | No. of contacts | A | B | C | D | E | F | G | H | J | K | L | M | N | | DF81-30S-0.4H(**) | 30 | 16.16 | 11.6 | 14 | 16 | 19 | 16.2 | 15.1 | 12.4 | 13.64 | 14.88 | 15.2 | 16.2 | 17.1 | | DF81-40S-0.4H(**) | 40 | 20.16 | 15.6 | 18 | 20 | 23 | 20.2 | 19.1 | 16.4 | 17.64 | 18.88 | 19.2 | 20.2 | 21.1 | | DF81-50S-0.4H(**) | 50 | 24.16 | 19.6 | 22 | 24 | 27 | 24.2 | 23.1 | 20.4 | 21.64 | 22.88 | 23.2 | 24.2 | 25.1 | |
| Models & Dimensions (Plug Solder Wire Termination) | | Product No. | No. of contacts | A | B | C | D | E | F | G | H | | DF81D-30P-0.4SD(51) | 30 | 11.6 | 12.76 | 15.8 | 16.8 | 4.4 | 8.4 | 7.2 | 12.6 | | DF81D-40P-0.4SD(51) | 40 | 15.6 | 16.76 | 19.8 | 20.8 | 10.4 | 6.2 | 12.0 | 16.6 | | DF81D-50P-0.4SD(51) | 50 | 19.6 | 20.76 | 23.8 | 24.8 | 14.4 | 10.2 | 16.8 | 20.6 | |
| Models & Dimensions (Outer Shell) | | Product No. | No. of contacts | A | B | C | | DF81-30P-SHL | 30 | 16.7 | - | 6.4 | | DF81-40P-SHL | 40 | 20.7 | 6.2 | 10.4 | | DF81-50P-SHL | 50 | 24.7 | 10.2 | 14.4 | |
| Models & Dimensions (Latch) | | Product No. | No. of contacts | A | | DF81-30P-LCH | 30 | 18.6 | | DF81-40P-LCH | 40 | 22.6 | | DF81-50P-LCH | 50 | 26.6 | |
| Handling Precautions | Recommended temperature profile for lead-free soldering. Recommended hand soldering conditions. Recommended screen thickness and aperture ratio. Warpage of the board (max 0.02 mm). IPA cleaning is allowed; consult for other cleaning agents. Mating/unmating on PCB recommended to prevent damage. |