Compact 0.5mm Pitch Right Angle ZIF SMT FPC Connector JUSHUO AFH34-S32FIA-1H for Electronic Connections
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Product Description
Product Overview
The AFH34 Series FPC Connector is a 0.5mm pitch, right-angle, ZIF (Zero Insertion Force) SMT connector designed for reliable connections in electronic devices. Featuring a front-insertion, back-flipping actuator mechanism, this connector ensures secure mating with Flexible Printed Circuits (FPCs). It is suitable for applications requiring a compact and robust interconnect solution, with options for gold flash plating for enhanced conductivity and durability.
Product Attributes
- Brand: SHENZHEN JUSHUO ELECTRONIC CO.,LTD
- Series Name: AFH34 Series
- Product Type: FPC Connector
- Pitch: 0.5mm
- Assembly Style: Right Angle / Low and top Contact SMT
- Actuator Type: ZIF / Front-insertion, Back-flipping
- Housing Material: LCP (Color: White, Flammability Rating: UL94V-0, Halogen Free)
- Actuator Material: LCP (Color: Black, Flammability Rating: UL94V-0)
- Contact Material: Copper Alloy
- Leg Material: Copper Alloy
- Plating Options: Gold flash (1u"AU / 5u"AU), Matte Tin
- Certifications: Halogen Free (HF)
- Origin: Shenzhen, China
Technical Specifications
| Specification | Details |
|---|---|
| Model Number | AFH34-S**FIA-1H |
| Pitch | 0.5 mm |
| Number of Contacts | 4 to 50 |
| Housing Height (H) | 1.0 mm |
| Contact Plating | Gold Flash (1u"AU / 5u"AU) |
| Nickel Underplating | 50u"-100u" |
| Leg Plating | Tin over Nickel |
| Operating Voltage (Max.) | 50Vrms |
| AC Current Rating (Max.) | 0.5A |
| Operating Temperature | -55C to +85C (Including terminal temperature rise) |
| Operating Humidity Range | Relative humidity 90% Max. |
| Storage Temperature Range | -10C to +50C |
| Storage Humidity Range | Relative humidity 90% Max. |
| Contact Resistance (Initial) | 40 m Max. |
| Insulation Resistance (Initial) | 50 M Min. |
| Dielectric Strength (Initial) | No Breakdown at 250V AC (rms) for 1 minute |
| FPC Retention Force | Pos. x 0.2N Min. |
| Terminal Retention Force | Pos. x 0.08Kgf {0.8N} Min. |
| Temperature Rise (Max Current) | 30C Max. |
| Vibration Test (Contact Resistance) | 60 m Max. |
| Vibration Test (Discontinuity) | 1 sec Max. |
| Shock Test (Contact Resistance) | 60 m Max. |
| Shock Test (Discontinuity) | 1 sec Max. |
| Heat Resistance Test (Contact Resistance) | 60 m Max. |
| Cold Resistance Test (Contact Resistance) | 60 m Max. |
| Humidity Test (Contact Resistance) | 60 m Max. |
| Humidity Test (Dielectric Strength) | No Breakdown |
| Humidity Test (Insulation Resistance) | 50 M Min. |
| Temperature Cycling Test (Contact Resistance) | 60 m Max. |
| Salt Spray Test (Contact Resistance) | 60 m Max. |
| Reflow Soldering Peak Temperature | 250C MAX. |
| Reflow Soldering Peak Time | 3 Sec. or less |
| Reflow Soldering Min. Temperature | 230C MIN. |
| Reflow Soldering Time at Min Temp. | 2040 Sec. |
| PCB Flatness Requirement | 0.1mm max. |
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Company
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Contact Person
Sellina