Kinghelm KH A12501 04Y 1.25 ultra thin series connector offering excellent insulation and durability
Product Overview
The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series offers a compact and thin profile, making it suitable for space-constrained environments. Key features include robust contact resistance, high dielectric strength, and excellent insulation properties, ensuring stable performance under demanding conditions. The connectors are constructed from high-quality materials with specific plating for durability and corrosion resistance. They are rated for 125V AC/DC and 1A AC/DC, with an operating temperature range of -25 to +85, compatible with AWG28#-32# wires. Applications include electronic devices requiring compact and dependable interconnect solutions.
Product Attributes
- Product Series: 1.25 Ultra-Thin Series Connector
- Brand: Kinghelm ()
- Housing Material: PBT UL94V-0, White
- Wafer Material: PA9T UL94V-0, Beige
- Terminal Material: Phosphor Bronze
- Contact Material: Phosphor Bronze
- Terminal Finish: Tin Plating (2.5-5m)
- Contact Finish: Gold Plating (0.5-1)
- Solder Tab Finish: Tin Plating (2.5-5m)
- Environmental Protection: RoHS 2.0
- Origin: China
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Scope | 1.25 Ultra-Thin Series Connector Specification | |
| Appearance & Dimension | Appearance | Product surface without defect, dirt, crack, and mechanical damage; Contact without rust, plating not oxidized and not peeled. |
| Dimension | According to drawings | |
| Material & Surface Treatment | Terminal Material | Phosphor bronze, thickness 0.15mm |
| Housing Material | PBT UL94V-0, White | |
| Wafer Material | PA9T UL94V-0, Beige | |
| Contact Material | Phosphor bronze, thickness 0.30mm | |
| Ratings & Applicable Wires | Rated Voltage | 125V AC/DC |
| Rated Current | 1A AC/DC | |
| Ambient Temperature Range | -25 to +85 | |
| Applicable Wire Gauge | AWG28#-32# | |
| Electrical Performance | Contact Resistance (Initial) | 20m Max |
| Contact Resistance (After Test) | 30m Max | |
| Withstand Voltage | 500V AC for 1 minute (No Breakdown/Flashover) | |
| Insulation Resistance | 100M Min (at 500V DC) | |
| Mechanical Performance | Terminal Crimping Wire Strength (AWG#28) | 13N |
| Terminal Crimping Wire Strength (AWG#30) | 8N | |
| Terminal Crimping Wire Strength (AWG#32) | 6N | |
| Terminal/Housing Retention Force | 8N Min per contact | |
| Insertion & Withdrawal Force | Refer to Section 8 | |
| Pin Retention Force | 2N Min per contact | |
| Endurance Characteristics | Repeated Insertion/Withdrawal (30 cycles) | Contact Resistance 30 m Max |
| Temperature Rise (at rated current) | 30 Max | |
| Vibration Test | Appearance: No damage; Contact Resistance 30 m Max; Discontinuity 1 micro-second Max. | |
| Heat Resistance (852, 96 hours) | Appearance: No damage; Contact Resistance 30 m Max | |
| Cold Resistance (-253, 96 hours) | Appearance: No damage; Contact Resistance 30 m Max | |
| Humidity (602, 90-95% RH, 96 hours) | Appearance: No damage; Contact Resistance 30 m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance 100M Min | |
| Temperature Cycling (5 cycles: -25 to +85) | Appearance: No damage; Contact Resistance 30 m Max | |
| Salt Spray (352, 51% solution, 241 hours) | Appearance: No damage; Contact Resistance 30 m Max | |
| Solderability (2455, 3-5 sec) | Solder Wetting 95% | |
| Solder Resistance (SMT reflow, 2555, 5-10 sec) | Refer to Section 9.1 for temperature curve; Appearance: No damage | |
| Insertion/Withdrawal Force | See table in Section 8 | |
| SMT Lead-Free Process | Refer to Section 9 for temperature curve. Pre-check reflow soldering conditions with own equipment. | |
| Caution | Avoid exposure to temperatures >30, humidity >60%RH after opening package. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering. | |
Section 8: Insertion/Withdrawal Force Table
| No. of CTK PIN | At Initial | At 30th Cycle | ||
|---|---|---|---|---|
| I.F (N Max) | W.F (N Min) | I.F (N Max) | W.F (N Min) | |
| 2 | 4.5 | 0.4 | 0.3 | 12 |
| 3 | 6.5 | 0.6 | 0.5 | 13 |
| 4 | 9 | 0.8 | 0.6 | 14 |
| 5 | 11 | 1.0 | 0.8 | 15 |
| 6 | 13 | 1.2 | 0.9 | 16 |
| 7 | 15.5 | 1.4 | 1.1 | 17 |
| 8 | 17.5 | 1.6 | 1.2 | 18 |
| 9 | 20 | 1.8 | 1.5 | 19 |
| 10 | 22 | 2.0 | 1.5 | 20 |
| 11 | 24 | 2.2 | 1.7 | 26.5 |
| 12 | 26.5 | 2.4 | 1.8 | 28.5 |
| 13 | 28.5 | 2.6 | 2.0 | 31 |
| 14 | 31 | 2.8 | 2.1 | 33 |
| 15 | 33 | 3.0 | 2.3 | 35 |
| 16 | 35 | 3.2 | 2.4 | 37 |
| 17 | 37 | 3.4 | 2.6 | 39 |
| 18 | 39 | 3.6 | 2.7 | 41 |
| 19 | 41 | 3.8 | 2.9 | 44 |
| 20 | 44 | 4.0 | 3.0 | |
Section 9: SMT Lead-Free Process Temperature Curve
Notes: Please check the reflow soldering condition by your own devices beforehand. Because the condition changes by the soldering devices, P.C. boards, and so on.
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