Ckmtw 2008S-2 8P wire to board connector providing electrical connections for 2008 PHD 2.0mm spacing

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Product Description

Product Overview

This specification covers the 2008 (PHD 2.0mm spacing) wire-to-board connector series. It is designed for applications requiring reliable electrical connections.

Product Attributes

Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD
Origin: China
Color: Beige ()

Technical Specifications

Product Name	Part Number	Rated Voltage (Max)	Rated Current (Max)	Applicable Wires	Applicable P.C.B. Hole Diameter	Ambient Temperature	Contact Resistance (Max)	Insulation Resistance (Min)	Dielectric Strength	Insertion Force and Withdrawal Force	Crimping Pull Out Force	Terminal Insertion Force (Max)	Terminal/Housing Retention Force (Min)	Pin Retention Force (Min)	Repeated Insertion/Withdrawal Contact Resistance (Max)	Salt Spray	Solderability	Resistance to Soldering Heat
Terminal	2008-T	250V DC/AC (rms)	2.0A	#28-#22	0.8~1.6mm	-25-+85	0.02	1000 M	800V AC for 1 minute (No breakdown/flashover)	Insertion force: 0.4 kgf/PIN (MAX) Retention force: 0.1 kgf/PIN (MIN)	#24: 2.3kg min #26: 1.4kg min #28: 0.9kg min	1.0 kgf MAX	0.8 kgf MIN	1.0 kgf MIN	40 m	Appearance: No Damage Contact Resistance: 40 m MAX	95% above tinned area	No Damage
Housing	2008H-XP
Wafer Assembly (180)	2008S-XP
Wafer Assembly (90)	2008R-XP	250V DC/AC (rms)	2.0A	#28-#22	0.8~1.6mm	-25-+85	0.02	1000 M	800V AC for 1 minute (No breakdown/flashover)	Insertion force: 0.4 kgf/PIN (MAX) Retention force: 0.1 kgf/PIN (MIN)	#24: 2.3kg min #26: 1.4kg min #28: 0.9kg min	1.0 kgf MAX	0.8 kgf MIN	1.0 kgf MIN	40 m MAX	12 hours exposure to salt spray (51% solution at 352)	Soldering time: 30.5 sec, solder temp: 2305 (95% above tinned area)	Soldering time: 51 sec, solder temp: 2605 (No Damage)