Ckmtw W 0800N07P R000 0.8mm Pitch Wire to Board Connector Rated 50V 0.5A for Compact Electronic Wiring
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Product Description
Product Overview
This specification applies to 0.8mm spacing pressure type bar connectors, specifically the SUH0.8 series. These connectors are designed for wire-to-board connections and are suitable for applications requiring a rated voltage of up to 50V AC/DC and a rated current of up to 0.5A for AWG#30 and AWG#32 wires. The operating temperature range is from -25 to +85.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Product Name: Line-to-board connector / SUH0.8 / 0.8mm pitch / Surface mount
- Part Number: W-0800NXXP-R000
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Surface Treatment: Nickel base, high tin
- Color: Natural (for Housing)
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Rated Current (MAX) | AWG#30: 0.5A AWG#32: 0.5A | |
| Insulation O.D. | 0.5-0.6mm | |
| Ambient temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA. | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground. | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground. | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA. | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. | 4-7N MIN |
| Contact Insertion Force | Insert and withdraw connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Insert and withdraw connectors with hand | 0.3N/PIN |
| Environmental and Other Performance | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load. (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz in 1 minute; Duration: 2 hours in each X, Y, Z axes. | Appearance: No Damage; Contact Resistance: 60 mMAX; Discontinuity: 1 ms.MAX. |
| Shock | 490m/s {50G}, 3 strokes in each X, Y, Z axes. | Appearance: No Damage; Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852, 96 hours; then return to room temperature for 1-2 hours. | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Cold Resistance | -402, 96 hours; then return to room temperature for 1-2 hours. | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Humidity | Temperature: 402; Relative Humidity: 90-94%; Duration: 96 Hours; then return to room temperature for 0.5 hours. | Appearance: No Damage; Contact Resistance: 60 mMAX; Dielectric Strength: Must meet 4.1.3; Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion; Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Solderability | Soldering Time: 20.5 sec; Soldering Temperature: 2355; 0.2 mm from terminal tip. | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec; Soldering Temperature: 2555; 0.2 mm from terminal tip. | Appearance: No Damage, Deformation |
Soldering Conditions
| Parameter | Specification |
|---|---|
| Average temperature gradient in preheating | 2.5C/s |
| Soak time (tsoak) | 2-3 minutes |
| Time above 150C (T1) | 60s |
| Time above 180C (T2) | 50s |
| Time above 250C (T3) | 2-5s |
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) |
| Temperature gradient in cooling | Max -5C/s |
| 230C MIN | 2010sec |
| Pre-Heat | 9030sec |
Note: This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures, used to achieve the specified profile, are higher and largely dependent on the reflow equipment.
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