Ckmtw W0800N05PR000 08mm pitch connector designed for wire to board pressure type bar connections
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This specification applies to 0.8mm spacing pressure-type bar connectors (SUH0.8). Designed for wire-to-board connections, these connectors offer a compact solution with a 0.8mm pitch.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Origin: China (Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD)
- Product Name: Wire-to-board connector / SUH0.8 / 0.8mm pitch / Vertical SMT
- Customer Part No: W-0800NXXP-R000
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Plating: Nickel Base, High Tin
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms) / DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA. | 20 milliohms MAX |
| On Crimped Portion: Measure by dry circuit, 20mV MAX, 10mA. | 5 milliohms MAX | |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground. | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminal or ground. | No Breakdown |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. | 4-7N MIN |
| Terminal/Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insertion Force: 1-2N/PIN |
| Withdrawal Force: 0.3N/PIN | ||
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load. (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; sweep vibration along XYZ axes; Amplitude: 5mm P-P; Frequency: 10-55-10Hz/min; Duration: 2 hours in each axis. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Discontinuity: 1 ms.MAX. | ||
| Shock | DC 1mA energized; 490m/s {50G} shock; 3 strokes in each X,Y,Z axes. | Appearance: No Damage |
| Discontinuity: 1 ms.MAX. | ||
| Heat Resistance | 852, 96 hours; then return to room temperature for 1-2 hours. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Cold Resistance | -402, 96 hours; then return to room temperature for 1-2 hours. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Humidity | Temperature: 402; Relative Humidity: 90-94%; Duration: 96 Hours; then return to room temperature for 0.5 hours. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Dielectric Strength: Must meet 4.1.3 | ||
| Insulation Resistance: 20 M MIN | ||
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temp water and dry. | Appearance: No Damage, Corrosion |
| Contact Resistance: 60 mMAX | ||
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage |
| Contact Resistance: 60 mMAX | ||
| Solderability | Soldering Time: 20.5 sec. Soldering Temperature: 2355. 0.2 mm from terminal tip. | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec. Soldering Temperature: 2555. 0.2 mm from terminal tip. | Appearance: No Damage, Deformation |
Soldering Conditions (Pb-free)
| Parameter | Specification |
|---|---|
| Average temperature gradient in preheating | 2.5C/s |
| Soak time (tsoak) | 2-3 minutes |
| Time above 150C (T1) | 60s |
| Time above 180C (T2) | 50s |
| Time above 250C (T3) | 2-5s |
| Peak temperature in reflow (Tpeak) | 255C (0/+5C) |
| Temperature gradient in cooling | Max -5C/s |
| Time above 230C | 2010 sec |
| Pre-Heat | 9030 sec |
Note: This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures used to achieve the specified profile are higher and largely dependent on the reflow equipment.
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