Pressure Type Bar Connector 0.8mm Pitch Rated Voltage 50V Current 0.5A Wire to Board Connection Ckmtw W-0800M08P-R000
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MOQ:
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Delivery Time:
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Product Description
Product Overview
This specification applies to 0.8mm spacing pressure type bar connectors, designed for wire-to-board connections. These connectors offer a rated voltage of 50V and a rated current of 0.5A for AWG#30 and AWG#32 wires. The operating temperature range is -25 to +85.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRAIAL CO.LTD
- Origin: Made in China
- Product Name: Line-to-board connector / SUH0.8 / 0.8mm pitch / Horizontal mount
- Part Number: W-0800MXXP-R000
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Company Address (Shenzhen): Building 5, No. 36, Ligong 4th Road, Xinhu Street, Guangming District, Shenzhen
- Company Address (Jiangxi): Putian Industrial Zone, Zhaojin Town, Xiushui County, Jiujiang City, Jiangxi Province
- Contact Tel: 0755-81488157
- Contact Fax: 0755-83425987
- Contact Email: ckm-tw168@163.com, ckm-scb@ckmtw.com.cn
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| 3 Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | External diameter: 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient temperature Range | -25 +85 | |
| 4 Performance | ||
| 4.1 Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (min) for 1 minute between adjacent terminal or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| 4.2 Mechanical Performance | ||
| Contact Retention force (Min.) | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insert force: 1-2N/PIN, Pull output: 0.3N/PIN |
| 4.3 Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X,Y,Z axes | Appearance: No Damage; Contact Resistance: 60 mMAX; Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s{50G}, 3 strokes in each X,Y,Z axes | Appearance: No Damage; Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 in air for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Cold Resistance | -402 in air for 96 hours; then return to room temperature for 1-2 hours | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours; then return to room temperature for 0.5 hours | Appearance: No Damage; Contact Resistance: 60 mMAX; Dielectric Strength: Must meet 4.1.3; Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from the 51% solution at 352. After test, wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion; Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402 | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | Appearance: No Damage; Contact Resistance: 60 mMAX |
| Solderability | Terminal tip immersed in 2355 tin bath for 20.5 sec. 0.2 mm from terminal tip | Solder Wetting: Apply Area More Than 95% |
| Resistance to Soldering Heat | Terminal tip immersed in 2555 tin bath for 50.5 sec. 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| 5 Conditions for soldering | ||
| Pb-free reflow profile requirements | Preheating Average temperature gradient | 2.5C/s |
| Pb-free reflow profile requirements | Soak time tsoak | 2-3 minutes |
| Pb-free reflow profile requirements | Time above 150C T1 | 60s |
| Pb-free reflow profile requirements | Time above 180C T2 | 50s |
| Pb-free reflow profile requirements | Time above 250C T3 | 2-5s |
| Pb-free reflow profile requirements | Peak temperature in reflow Tpeak | 255C (0/+5C) |
| Pb-free reflow profile requirements | Temperature gradient in cooling | Max -5C/s |
| 6 Product Shape, Dimensions and Materials | ||
| NAME | MATERIAL | REMARK |
| Housing | LCP (Natural color) | |
| Contact | Phosphor Copper | Metal surface nickel plated, high tin |
| Welding Slice | Phosphor Copper | Metal surface nickel plated, high tin |
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