Wire to board connector SUH0.8 0.8mm pitch horizontal mount Ckmtw W-0800M04P-R000 rated 50V 0.5A current
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Delivery Time:
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Product Description
Product Overview
SUH0.8 is a 0.8mm pitch pressure-type bar connector designed for wire-to-board connections. It offers a rated voltage of 50V and a rated current of 0.5A, suitable for wires with an outer diameter of 0.5-0.6mm (AWG#30, AWG#32). The operating temperature range is -25 to +85.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Origin: China
- Product Name: Line-to-board connector / SUH0.8 / 0.8mm pitch / Horizontal mount
- Part Number: W-0800MXXP-R000
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Company Address (Shenzhen): Building 5, No. 36, Ligong 4th Road, Xinhu Street, Guangming District, Shenzhen
- Company Address (Jiangxi): Putian Industrial Zone, Zhaojin Town, Xiushui County, Jiujiang City, Jiangxi Province
- Contact Tel: 0755-81488157
- Contact Fax: 0755-83425987
- Contact Email: ckm-tw168@163.com, ckm-scb@ckmtw.com.cn
- Housing Material: LCP (Natural Color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Contact/Welding Slice Surface Treatment: Nickel Base, High Tin
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient temperature Range | -25 +85 | |
| Performance - Electrical | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminal or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC(rms) for 1 minute between adjacent terminal or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohoms MAX |
| Performance - Mechanical | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion Force | Insert and withdraw connectors with hand | 1-2N/PIN |
| Contact Withdrawal Force | Insert and withdraw connectors with hand | 0.3N/PIN |
| Performance - Environmental and Others | ||
| Repeated Insertion and Withdrawal | Insertion and withdrawal up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA, Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X,Y,Z axes | Appearance: No Damage, Contact Resistance: 60 mMAX, Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA, 490m/s{50G}, 3 strokes in each X,Y,Z axes | Appearance: No Damage, Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852, 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Cold Resistance | -402, 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Humidity | Temperature: 402, Relative Humidity: 90-94%, Duration: 96 Hours, then measure at room temperature within 0.5 hours | Appearance: No Damage, Contact Resistance: 60 mMAX, Dielectric Strength: Must meet 4.1.3, Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: a) -253 30 minutes b) 852 30 minutes | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. After test, wash with room temperature water and dry at room temperature. | Appearance: No Damage, Corrosion, Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage, Contact Resistance: 60 mMAX |
| Solderability | Soldering Time: 20.5 sec, Soldering Temperature: 2355, 0.2 mm from terminal tip | Solder Wetting Apply Area: More Than 95% |
| Resistance to Soldering Heat | Soldering Time: 50.5 sec, Soldering Temperature: 2555, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| Conditions for Soldering (Pb-free) | ||
| Pre-heating Average temperature gradient | 2.5C/s | |
| Soak time (tsoak) | Time above 150C (T1) | 2-3 minutes |
| Time above 180C (T2) | 60s | |
| Time above 250C (T3) | 50s | |
| Peak temperature in reflow (Tpeak) | 2-5s | |
| Cooling Temperature gradient | 255C (0/+5C) Max -5C/s | |
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