Wafer Connector Strip Needle Seat Ultra Thin 125 Millimeter Pitch Gold Plated Ckmtw W 1253M03P 0420

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

This specification outlines the requirements for the 1.25 series ultra-thin wafer connector strip, designed for various electrical applications. It details product performance, testing methods, and inspection criteria to ensure reliability and compatibility.

Product Attributes

  • Brand: SHENZHEN CANKEMENG INDUSTRIAL CO., LTD
  • Origin: China
  • Certifications: RoHS
  • Material (Housing): PBT (UL94V-0, White), Nylon6T (UL94V-0, Beige)
  • Material (Contact/Terminal/Wafer): Phosphor bronze
  • Plating: Gold Plating (Fu~3")

Technical Specifications

ItemDescriptionRequirement
GeneralProduct DescriptionNeedle Seat / 1.25mm Pitch / Wafer / Ultra-thin / Gold Plating
Customer Part No.W-1253MXXP-0420
Use ConditionAmbient Temperature Range-25+85
Applicable Wire SizesAWG#28#32
Applicable PC Board Thickness0.6~1.2mm
Electrical PerformanceRated Current1A (AC/DC)
Rated Voltage125V (AC/DC)
Contact Resistance (Initial)20 m
Withstand Voltage500V AC (rms) for 1 minute, leakage current 0.5mA, no breakdown/flashover
Insulation Resistance100 M (at 500V DC for 1 minute)
Mechanical PerformanceTerminal Crimping Wire StrengthAWG#28: 13N, AWG#30: 8N, AWG#32: 6N
Fixed Terminals and Hole Seat Force8N (per contact)
Single Contact Insertion Force3N
Single Contact Withdrawal Force0.3N
Pin Retention Force10N (per contact)
Durability (Cycles)30 cycles, Contact Resistance 30 m
Environmental PerformanceThermal Aging852 for 96 hours, Contact Resistance 30 m
Temperature Rise30 Max (at rated current)
Humidity (Constant)402, 90-95%RH for 96 hours, Contact Resistance 30m, Insulation Resistance 50M, No breakdown/flashover
Temperature Cycling5 cycles (-55 to 85), Same requirements as Humidity
Salt Spray353, 51% solution, 8 hours (post-plate) or 48 hours (pre-plate), Contact Resistance 30 m
SolderabilitySolder Temp: 2455, Immersion: 30.5S, Soldering Area: 90%
Resistance to Soldering Heat (Manual)Soldering Time: 30.5S, Soldering Pot: 3055
Resistance to Soldering Heat (Reflow)Soldering Time: Max 20S, Soldering Pot: 2555 (Refer to 9.1 curve)
PackagingTerminal PackagingReel packaging
Housing PackagingPlastic bags
Wafer PackagingReel or bag packaging
Exterior PackagingCarton with packing list
TransportationTemperature Range-20~+50
StorageTemperature Range-20~+40, Relative Humidity 80%
Re-qualificationRequired if stored > 6 months

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.