Durable pressure type bar connector Ckmtw W-0800N03P-R000 featuring 08mm spacing for wire to board connections
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification applies to the SUH0.8 (0.8mm spacing) pressure type bar connectors, designed for wire-to-board connections.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO. LTD
- Product Name: SUH0.8 (0.8mm spacing) pressure type bar connectors
- Customer Part No: W-0800NXXP-R000
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO. LTD
- Company Address (Jiangxi): Putian Industrial Zone, Zhajin Town, Xiushui County, Jiujiang City, Jiangxi Province
- Company Address (Shenzhen): Building 5, No. 36, Ligongsi Road, Lihu Community, Xinhua Street, Guangming District, Shenzhen
- Contact Tel: 0755-81488157
- Contact Fax: 0755-83425987
- Contact Email: ckm-tw168@163.com, ckm-scb@ckmtw.com.cn
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| 1. Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC (rms) / DC] | |
| Insulation O.D. | Φ0.5-Φ0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A, AWG#32: 0.5A | |
| Ambient Temperature Range | -25℃ ~ +85℃ | |
| 2. Performance | ||
| 2.1 Electrical Performance | ||
| Contact Resistance | Measured by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measured by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| 2.2 Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 25±3mm/minute on the contact assembled in the housing | 4-7N MIN |
| Terminal/Housing Retention Force | Apply axial pull out force at a speed of 25±3mm/minute on the contact assembled in the housing | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insertion: 1-2N/PIN, Withdrawal: 0.3N/PIN |
| 2.3 Environmental and Other Performance | ||
| Repeated Insertion and Withdrawal | 20 cycles at a speed rate of less than 10 cycles/minute (no power) | Contact Resistance: 60 mΩ MAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 ℃ MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep time: 10-55-10Hz/min; Duration: 2 hours in each X, Y, Z axes | Appearance: No Damage; Contact Resistance: 60 mΩ MAX; Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s² {50G}, 3 strokes in each X, Y, Z axes | Appearance: No Damage; Discontinuity: 1 ms.MAX. |
| Heat Resistance | 85±2℃ for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage; Contact Resistance: 60 mΩ MAX |
| Cold Resistance | -40±2℃ for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage; Contact Resistance: 60 mΩ MAX |
| Humidity | 40±2℃, 90-94% RH for 96 hours, then return to room temperature for 0.5 hours | Appearance: No Damage; Contact Resistance: 60 mΩ MAX; Dielectric Strength: Must meet 4.1.3; Insulation Resistance: 20 MΩ MIN |
| Temperature Cycling | 5 cycles of: -25±3℃ for 30 min; 85±2℃ for 30 min (with intermediate room temp/humidity dwell) | Appearance: No Damage; Contact Resistance: 60 mΩ MAX |
| Salt Spray | 24 hours exposure to 5±1% salt spray at 35±2℃. Post-test wash with water and dry at room temp. | Appearance: No Damage, Corrosion; Contact Resistance: 60 mΩ MAX |
| SO2 Gas Resistance | 24 hours exposure to 50±5ppm SO2 gas at 40±2℃ | Contact Resistance: 60 mΩ MAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution | Appearance: No Damage; Contact Resistance: 60 mΩ MAX |
| Solderability | Immersion in 235±5℃ tin bath for 2±0.5 sec, 0.2 mm from terminal tip | Solder Wetting: More Than 95% Apply Area |
| Resistance to Soldering Heat | Immersion in 255±5℃ tin bath for 5±0.5 sec, 0.2 mm from terminal tip | Appearance: No Damage, Deformation |
| 3. Conditions for Soldering (Pb-free) | ||
| Preheating Average Temperature Gradient | 2.5±C/s | |
| Soak Time (tsoak) | Time above 150±C (T1) | 2-3 minutes |
| Time above 180±C (T2) | Time above 250±C (T3) | 60s |
| Peak Temperature (Tpeak) | 50s | |
| Cooling Temperature Gradient | 2-5s | |
| Time above 230±C | 255±0/5±C | |
| Pre-Heat Time | Max -5±C/s | |
| 4. Product Shape, Dimensions and Materials | ||
| Name | Material | Remark |
| Housing | LCP (Natural Color) | |
| Contact | Phosphor Copper | Surface Metal: Nickel Base, High Tin |
| Welding Slice | Phosphor Copper | Surface Metal: Nickel Base, High Tin |
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