Ckmtw W 0800M07P R000 wire to board connector with durable nickel base surface treatment 0.8mm pitch
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SUH0.8 is a pressure-type bar connector with a 0.8mm pitch, designed for wire-to-board connections. It operates within a voltage rating of 50V AC/DC and a current rating of 0.5A, suitable for AWG#30 and AWG#32 wires. The connector is built to withstand a wide ambient temperature range of -25 to +85, making it versatile for various industrial applications.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO. LTD
- Product Name: Wire-to-board connector
- Model: SUH0.8 / 0.8mm pitch / Horizontal mount
- Customer Part No: W-0800MXXP-R000
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO. LTD
- Housing Material: LCP (Natural color)
- Contact Material: Phosphor Copper
- Welding Slice Material: Phosphor Copper
- Surface Treatment: Nickel base, high tin
Technical Specifications
| Item | Specification | Requirement |
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | [AC(rms)/DC] | 50V |
| Insulation O.D. | External diameter: 0.5-0.6mm | - |
| Rated Current (MAX) | AWG#30 | 0.5A |
| Rated Current (MAX) | AWG#32 | 0.5A |
| Ambient temperature Range | - | -25 +85 |
| Performance | ||
| Contact Resistance | Test Condition | Measure by dry circuit, 20mV MAX, 10mA. |
| Requirement | 20 milliohms MAX | |
| Insulation Resistance | Test Condition | Apply 100V DC between adjacent terminal or ground. |
| Requirement | 100 Megohms MIN | |
| Dielectric Strength | Test Condition | Apply 200V AC (rms) for 1 minute between adjacent terminal or ground. |
| Requirement | No Breakdown | |
| Contact Resistance On Crimped Portion | Test Condition | Measure by dry circuit, 20mV MAX, 10mA. |
| Requirement | 5 milliohoms MAX | |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Test Condition | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. |
| Requirement | 4-7N MIN | |
| Terminal /Housing Retention Force (Min.) | Test Condition | Apply axial pull out force at a speed of 253mm/minute on the contact assembled in the housing. |
| Requirement | 4-7N MIN | |
| Contact Insertion and Withdrawal Force | Test Condition | Insert and withdraw connectors with hand |
| Requirement | Insert force: 1-2N/PIN, Pull output: 0.3N/PIN | |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Test Condition | Insertion and withdrawal actuator up to 20 cycles at the speed rate of less than 10 cycles/minute (no power) |
| Requirement | Contact Resistance: 60 mMAX | |
| Temperature Rise | Test Condition | Carrying rated current load. (UL 498) |
| Requirement | 30 MAX | |
| Vibration Resistance | Test Condition | DC 1mA energized; vibration along XYZ axes; amplitude 5mm P-P; sweep time 10-55-10Hz/min; duration 2 hours in each axis. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX; Discontinuity: 1 ms.MAX. | |
| Shock Resistance | Test Condition | DC 1mA energized; 490m/s{50G} shock in 6 directions perpendicular to each other; 3 strokes each. |
| Requirement | Appearance: No Damage; Discontinuity: 1 ms.MAX. | |
| Heat Resistance | Test Condition | 852 in air for 96 hours; then return to room temperature for 1-2 hours. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX | |
| Cold Resistance | Test Condition | -402 in air for 96 hours; then return to room temperature for 1-2 hours. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX | |
| Humidity Resistance | Test Condition | 402, 90-94% RH for 96 hours; then measure at room temperature within 0.5 hours. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX; Dielectric Strength: Must meet 4.1.3; Insulation Resistance: 20 M MIN | |
| Temperature Cycling | Test Condition | 5 cycles of: a) -253 for 30 minutes; b) 852 for 30 minutes; with 10-15 minutes at room temp/humidity between cycles. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX | |
| Salt Spray Resistance | Test Condition | 24 hours exposure to 51% salt spray at 352. Wash with room temp water after test; then dry at room temp. |
| Requirement | Appearance: No Damage, Corrosion; Contact Resistance: 60 mMAX | |
| SO2 Gas Resistance | Test Condition | 24 hours exposure to 505ppm SO2 gas at 402. |
| Requirement | Contact Resistance: 60 mMAX | |
| NH3 Gas Resistance | Test Condition | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. |
| Requirement | Appearance: No Damage; Contact Resistance: 60 mMAX | |
| Solderability | Test Condition | Terminal tip immersed in a 2355 tin bath for 20.5 sec, 0.2 mm from terminal tip. |
| Requirement | Solder Wetting: More Than 95% Apply Area | |
| Resistance to Soldering Heat | Test Condition | Terminal tip immersed in a 2555 tin bath for 50.5 sec, 0.2 mm from terminal tip. |
| Requirement | Appearance: No Damage, Deformation | |
| Conditions for Soldering (Pb-free) | ||
| Parameter | Reference | Specification |
| Average temperature gradient in preheating | - | 2.5C/s |
| Soak time (tsoak) | - | 2-3 minutes |
| Time above 150C (T1) | - | 60s |
| Time above 180C (T2) | - | 50s |
| Time above 250C (T3) | - | 2-5s |
| Peak temperature in reflow (Tpeak) | - | 255C (0/+5C) |
| Temperature gradient in cooling | - | Max -5C/s |
| 230C MIN | 2010sec | - |
| Pre-Heat | 9030sec | - |
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