Wire to board connectors pressure type bar 0.8mm pitch Ckmtw W-0800M02P-R000 for electrical contact

Name: Wire to board connectors pressure type bar 0.8mm pitch Ckmtw W-0800M02P-R000 for electrical contact
Brand: Hefei Purple Horn E-Commerce Co., Ltd.

Price Negotiable

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Product Description

Product Overview

0.8mm pitch pressure type bar connectors for wire-to-board connections. Designed for applications requiring reliable electrical connections between wires and circuit boards.

Product Attributes

Brand: SHENZHEN CANKEMENG INDUSTRAIAL CO.LTD
Origin: China
Product Name: SUH0.8 (0.8mm pitch)
Part Number: W-0800MXXP-R000
Base Material: LCP (Natural Color)
Contact Material: Phosphor Copper
Welding Slice Material: Phosphor Copper
Plating: Nickel Base, High Tin

Technical Specifications

Item	Specification	Requirement
Ratings and Applicable Wires
Rated Voltage (MAX)	50V [AC(rms)/DC]
Insulation O.D.	0.5-0.6mm
Rated Current (MAX)	AWG#30	0.5A
Rated Current (MAX)	AWG#32	0.5A
Ambient Temperature Range		-25 +85
Performance
Contact Resistance	Measure by dry circuit, 20mV MAX, 10mA	20 milliohms MAX
Contact Resistance	On Crimped Portion (measure by dry circuit, 20mV MAX, 10mA)	5 milliohoms MAX
Insulation Resistance	Apply 100V DC between adjacent terminal or ground	100Megohms MIN
Dielectric Strength	Apply 200V AC (min) for 1 minute between adjacent terminal or ground	No Breakdown
Mechanical Performance
Contact Retention Force (Min.)	Apply axial pull out force at a speed of 253mm/minute	4-7N MIN
Terminal /Housing Retention Force	Apply axial pull out force at a speed of 253mm/minute	4-7N MIN
Contact Insertion and Withdrawal Force	Insert force	1-2N/PIN
Contact Insertion and Withdrawal Force	Pull output	0.3N/PIN
Environmental Performance and Others
Repeated Insertion and Withdrawal	Insertion and withdrawal actuator up to 20 cycles at a speed rate of less than 10 cycles/minute
Repeated Insertion and Withdrawal	Contact Resistance	60 mMAX
Temperature Rise	Carrying rated current load (UL 498)	30 MAX
Vibration	Amplitude: 5mm P-P, Sweep time: 10-55-10Hz/min, Duration: 2 hours in each X.Y.Z. axes, DC 1mA energized
	Contact Resistance	60 mMAX
	Discontinuity	1 ms.MAX.
Shock	490m/s{50G}, 3 strokes in each X.Y.Z. axes, DC 1mA energized
Shock	Discontinuity	1 ms.MAX.
Heat Resistance	852, 96 hours, then return to room temperature for 1-2 hours
Heat Resistance	Contact Resistance	60 mMAX
Cold Resistance	-402, 96 hours, then return to room temperature for 1-2 hours
Cold Resistance	Contact Resistance	60 mMAX
Humidity	Temperature: 402, Relative Humidity: 90-94%, Duration: 96 Hours, then measure at room temperature within 0.5 hours
Humidity	Contact Resistance	60 mMAX
Dielectric Strength	Must meet 4.1.3
Insulation Resistance		20 M MIN
Temperature Cycling	5 cycles of: a) -253 30 minutes b) 852 30 minutes, with 10-15 minutes at room temp/humidity between cycles
Temperature Cycling	Contact Resistance	60 mMAX
Salt Spray	24 hours exposure to a salt spray from the 51% solution at 352. After test, wash with room temp water and dry at room temp.
Salt Spray	Contact Resistance	60 mMAX
SO2 Gas Resistance	24 hours exposure to 505ppm SO2 gas at 402.	Contact Resistance: 60 mMAX
NH3 Gas Resistance	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution
NH3 Gas Resistance	Contact Resistance	60 mMAX
Solderability	Soldering Time: 20.5 sec, Soldering Temperature: 2355, 0.2 mm from terminal tip
Solderability	Solder Wetting Area	More Than 95%
Resistance to Soldering Heat	Soldering Time: 50.5 sec, Soldering Temperature: 2555, 0.2 mm from terminal tip	Appearance: No Damage, Deformation
Conditions for Soldering (Pb-free)
Parameter	Specification
Average temperature gradient in preheating	2.5C/s
Soak time (tsoak)	2-3 minutes
Time above 150C (T1)	60s
Time above 180C (T2)	50s
Time above 250C (T3)	2-5s
Peak temperature in reflow (Tpeak)	255C (+0/-5C)
Temperature gradient in cooling	Max -5C/s