Durable 0.8mm pitch pressure type bar connector Ckmtw W-0800M09P-R000 for wire to board applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification applies to 0.8mm spacing pressure type bar connectors. Designed for wire-to-board connections, these connectors offer reliable electrical performance and mechanical durability.
Product Attributes
- Brand: SHENZHEN CANKEMENG INDUSTRIAL CO.LTD
- Product Name: Line-to-board connector / SUH0.8 / 0.8mm pitch / Horizontal mount
- Customer Part No: W-0800MXXP-R000
- Origin: Shenzhen, China
- Manufacturing Base: JIANGXI CANKEMENG ELECTRONICS CO.LTD
- Company Address (Shenzhen): Building 5, No. 36, Ligong Fourth Road, Xinhu Street, Guangming District, Shenzhen
- Company Address (Jiangxi): Putian Industrial Zone, Zhaojin Town, Xiushui County, Jiujiang City, Jiangxi Province
- Contact Tel: 0755-81488157
- Contact Fax: 0755-83425987
- Email: ckm-scb@ckmtw.com.cn, ckm-scb@ckmtw.com.cn
Technical Specifications
| Item | Specification | Requirement |
|---|---|---|
| Ratings and Applicable Wires | ||
| Rated Voltage (MAX) | 50V [AC(rms)/DC] | |
| Insulation O.D. | 0.5-0.6mm | |
| Rated Current (MAX) | AWG#30: 0.5A AWG#32: 0.5A | |
| Ambient Temperature Range | -25 +85 | |
| Performance | ||
| Electrical Performance | ||
| Contact Resistance | Measure by dry circuit, 20mV MAX, 10mA | 20 milliohms MAX |
| Insulation Resistance | Apply 100V DC between adjacent terminals or ground | 100 Megohms MIN |
| Dielectric Strength | Apply 200V AC (rms) for 1 minute between adjacent terminals or ground | No Breakdown |
| Contact Resistance On Crimped Portion | Measure by dry circuit, 20mV MAX, 10mA | 5 milliohms MAX |
| Mechanical Performance | ||
| Contact Retention Force (Min.) | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Terminal /Housing Retention Force | Apply axial pull out force at a speed of 253mm/minute | 4-7N MIN |
| Contact Insertion and Withdrawal Force | Insert and withdraw connectors with hand | Insertion: 1-2N/PIN Withdrawal: 0.3N/PIN |
| Environmental Performance and Others | ||
| Repeated Insertion and Withdrawal | Up to 20 cycles at a speed rate of less than 10 cycles/minute | Contact Resistance: 60 mMAX |
| Temperature Rise | Carrying rated current load (UL 498) | 30 MAX |
| Vibration | DC 1mA energized; Amplitude: 5mm P-P; Sweep: 10-55-10Hz/min; Duration: 2 hours in each X, Y, Z axes | Appearance: No Damage Contact Resistance: 60 mMAX Discontinuity: 1 ms.MAX. |
| Shock | DC 1mA energized; 490m/s {50G}, 3 strokes in each X, Y, Z axes | Appearance: No Damage Discontinuity: 1 ms.MAX. |
| Heat Resistance | 852 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Cold Resistance | -402 for 96 hours, then return to room temperature for 1-2 hours | Appearance: No Damage Contact Resistance: 60 mMAX |
| Humidity | 402, 90-94% RH for 96 hours, then measure at room temperature within 0.5 hours | Appearance: No Damage Contact Resistance: 60 mMAX Dielectric Strength: Must meet 4.1.3 Insulation Resistance: 20 M MIN |
| Temperature Cycling | 5 cycles of: -253 for 30 min; 852 for 30 min; with 10-15 min at room temp/humidity between cycles | Appearance: No Damage Contact Resistance: 60 mMAX |
| Salt Spray | 24 hours exposure to a salt spray from 51% solution at 352. Wash with room temp water and dry at room temp after test. | Appearance: No Damage, No Corrosion Contact Resistance: 60 mMAX |
| SO2 Gas Resistance | 24 hours exposure to 505ppm SO2 gas at 402. | Contact Resistance: 60 mMAX |
| NH3 Gas Resistance | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage Contact Resistance: 60 mMAX |
| Solderability | Terminal tip immersed 0.2mm from tip into 2355 tin bath for 20.5 sec. | Solder Wetting: More than 95% Apply Area |
| Resistance to Soldering Heat | Terminal tip immersed 0.2mm from tip into 2555 tin bath for 50.5 sec. | Appearance: No Damage, No Deformation |
| Conditions for Soldering (Pb-free) | ||
| Parameter | Reference | Specification |
| Average temperature gradient in preheating | 2.5C/s | |
| Soak time (tsoak) | Time above 150C (T1) | 2-3 minutes |
| Time above 180C (T2) | 60s | |
| Time above 250C (T3) | 50s | |
| Peak temperature in reflow (Tpeak) | 2-5s | |
| Temperature gradient in cooling | 255C (0/+5C) | |
| 230C MIN | Max -5C/s | |
| Pre-Heat 9030sec | 2010sec | |
| Product Shape, Dimensions and Materials | ||
| Name | Material | Remark |
| Housing | LCP (Natural Color) | |
| Contact | Phosphor Copper | Metal Surface Nickel Plated, High Tin |
| Welding Slice | Phosphor Copper | Metal Surface Nickel Plated, High Tin |
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