back locking 1.0mm pitch FFC FPC connector DIANWEI 8.04A0.008200 for 0.3mm thick flexible flat cables

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Product Description

Product Overview

The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. It is designed for 0.3mm thick FFC/FPC cables and features a back-locking mechanism. This connector is suitable for various applications requiring reliable and compact interconnect solutions.

Product Attributes

Brand: DIANWEI
Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD
Certifications: IATF16949, ISO9001:2015, ISO14001,

Technical Specifications

Specification	Details
Product Name	1.0mm FFC/FPC dual contact side connector (H=2.0mm)
Series	8.04A
Pitch	1.0mm
Height (H)	2.0mm
Applicable FFC/FPC Thickness	0.3mm 0.02mm
Contact Type	Dual contact side connector
Locking Mechanism	Back-locked (Rotary lock)
Housing Material	LCP Nature Color (UL 94V-0)
Cover Material	LCP Black (UL 94V-0)
Terminal Material	Copper Alloy
Stator Material	Copper Alloy
Plating Specification	Contact area and solder area: Gold plating 1~3u" (See drawing)
Coplanarity	0.10mm MAX
Operation Temperature	-40 ~ +85 (without ice or dew)
Operation Humidity	20-85% RH
Storage Temperature	-10 ~ +50 (without ice or dew)
Storage Humidity	20-85% RH
Rated Voltage	50V (AC/DC) at 20 ambient temperature
Rated Current	0.5A / PIN at 20 ambient temperature
Contact Resistance	30m Max (Mate applicable FPC, 100mA, 20mV Max DC)
Insulation Resistance	500M MIN (Apply 250V DC for 1 minute between adjacent terminals)
Dielectric Strength	No breakdown or short circuit (Apply 250V AC for 1 minute between adjacent terminals)
Retention Force of Single Pin	0.2N / PIN MIN (Axial pull out force at 25~100mm/Min)
Retention Force of GND Pin	0.3N / PIN MIN (Axial pull out force at 25~100mm/Min)
Retention Force of FFC/FPC	0.3N Min/Pin (Insert FFC, axial pull out force at 20~100mm/Min)
Shock Resistance	Acceleration 490m/s, 11ms, 3 times per 6 directions. 1sec Max discontinuity, 50m MAX Contact resistance after test.
Vibration Resistance	Amplitude: 1.52mm, Frequency: 10~55~10Hz/min, 2 hours per axis (X/Y/Z). FPC mated state.
Durability (Lock/Dis-lock)	20 times with loading. 50m MAX Contact resistance, No Damage after test.
Heat Resistance	852 for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m MAX Contact resistance, No damage, Retention force above 0.3N/Pin after test.
Humidity Resistance	403, 90~95% RH for 96H. 1H conditioning at ambient. 1sec Max discontinuity, 50m Max Contact Resistance, 500 M Min Insulation Resistance, No damage Dielectric, Visual ok after test.
High/Low Temperature Cycle	5 cycles based on table. 1H conditioning at ambient. 1sec Max discontinuity, 50 m Max Contact Resistance, Visual ok, Retention force above 0.3N/Pin after test.
Salt Spray (Gold Plating)	5% salt water density, 351 for 48H. No corrosion after test.
Solderability	Dip soldering tail into Tin oven at 2455 for 3sec. Easy wetting, Tin cover over 90% of dipping area.
Resistance to Soldering Heat	Preheating: 150~180 60~120Sec. Soldering: Peak temp 260, over 230 last 305Sec. Contact resistance 50m Max., no damage, Retention force above 0.3N/Pin after test.
Recommended Soldering Profile	Preheating: 150~180 60~120Sec. Soldering: Peak temp 2505, over 225 last 305Sec. Lock cover shall be opened during SMT. (Reference only)