FFC FPC dual contact side connector 1.0mm pitch height 2.0mm DIANWEI 8.04A0.012200 suitable for 0.3mm thick cables
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This specification applies to the 8.04A series of 1.0mm pitch FFC/FPC dual contact side connectors with a height of 2.0mm. These connectors feature a back-locking mechanism and are designed for use with 0.3mm thick FFC/FPC cables, supporting 4 to 40 pins. They are suitable for SMT processes and offer dual contact for reliable electrical connections.
Product Attributes
- Brand: DIANWEI (DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD)
- Origin: Dongguan, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) | |
| Series | 8.04A | |
| Pitch | 1.0mm | |
| Height | H=2.0mm | |
| Applicable Cable Thickness | 0.3mm 0.02mm | |
| Pin Count | 4-40pin | |
| Contact Type | Dual contact side connector | |
| Locking Mechanism | Back-locked (Rotary lock) | Special caution: Lock cover must be opened before SMT soldering or FPC insertion. |
| Housing Material | LCP Nature Color (UL 94V-0) | |
| Cover Material | LCP Black (UL 94V-0) | |
| Terminal Material | Copper Alloy | |
| Stator Material | Copper Alloy | |
| Plating | Contact area and solder area: Gold plating 1~3u | See drawing for details. |
| Coplanarity | 0.10mm MAX | |
| Operation Temperature | -40 ~ +85 | Without ice or dew |
| Operation Humidity | 20-85RH | |
| Storage Temperature | -10 ~ +50 | Without ice or dew |
| Storage Humidity | 2085%RH | |
| Rated Voltage | 50V (AC/DC) | At ambient temperature 20 |
| Rated Current | 0.5A / PIN | At ambient temperature 20 |
| Contact Resistance | 30m Max | Mate applicable FPC, measure by dry circuit, 20mV Max. DC, 100mA. |
| Insulation Resistance | 500M MIN | Apply 250V DC for 1 Minute between adjacent terminals. |
| Dielectric Strength | No breakdown, no short circuit | Apply 250V AC for 1 Minute between adjacent terminals. |
| Retention Force of Single Pin | 0.2N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min. |
| Retention Force of GND Pin | 0.3N / PIN MIN | Apply axial pull out force at the rate of 25~100mm/Min. |
| Retention Force of FFC/FPC | 0.3N Min/Pin | Insert FFC into connector, apply axial pull out force at the rate of 20~100mm/Min. (Total: PIN Count X 0.3N Min) |
| Shock Resistance | Discontinuity 1sec Max. Contact resistance 50m MAX. No damage. | Test speed 490m/s, lasting 11ms, 3 times each of 6 directions. FPC mated state. |
| Vibration Resistance | Contact resistance 50m MAX. No damage. | Amplitude: 1.52mm, Frequency: 10~55~10Hz in 1 minute. X/Y/Z directions, 2 hours each. FPC mated state. |
| Durability (Lock/Unlock) | Contact resistance 50m MAX. No damage. | 20 times with loading. |
| Heat Resistance | Discontinuity 1sec Max. Contact resistance 50m MAX. No damage. Retention force 0.3N/Pin. | Expose to 852 for 96H. Conditioned at ambient for 1H. FPC mated state. |
| Humidity Resistance | Discontinuity 1sec Max. Contact Resistance 50m Max. Insulation Resistance 500M Min. Dielectric: No damage, Shorting. Visual ok. | Expose to 403, 90~95% RH for 96H. Conditioned at ambient for 1H. FPC mated state. |
| High/Low Temperature Cycle | Discontinuity 1sec Max. Contact Resistance 50 m Max. Visual ok. Retention force 0.3N/Pin. | 5 cycles based on table. Conditioned at ambient for 1H. FPC mated state. |
| Salt Spray (Gold Plating) | No Corrosion | Expose to 5% salt water density at 351 for 48H. |
| Solderability | Soldering tail easy wetting by melted tin, Tin coverage 90% of dipping area. | Dip soldering tail into Tin oven at 2455 for 3 sec. |
| Resistance to Soldering Heat | Contact resistance 50m Max., no damage. Retention force 0.3N/Pin. | Preheating: 150~180 60~120Sec. Soldering: Peak temp 260, over 230 last 305Sec. |
| Recommended Soldering Profile | Refer to profile for reference. Lock cover shall be opened. | Preheating: 150~180 60~120Sec. Soldering: Peak temp 2505, over 225 last 305Sec. |
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