1.0mm pitch dual contact side connector DIANWEI 8.04A0.005200 designed for 0.3mm thick FFC FPC cables
Price:
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MOQ:
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Delivery Time:
Negotiable
Product Description
Product Overview
The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick FFC/FPC cables, it features a back-locking mechanism and is suitable for applications requiring reliable electrical and mechanical performance. The connector is manufactured by DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO., LTD and is available in various pin counts (4-40pin).
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN, China
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | 1.0mm FFC/FPC dual contact side connector (H=2.0mm) |
| Series | 8.04A |
| Pitch | 1.0mm |
| Height (H) | 2.0mm |
| Applicable FFC/FPC Thickness | 0.3mm 0.02mm |
| Pin Count | 4-40pin |
| Contact Type | Dual contact, Side connector |
| Locking Mechanism | Back-locked (Rotary type) |
| Housing Material | LCP Nature Color (UL 94V-0) |
| Cover Material | LCP Black (UL 94V-0) |
| Terminal Material | Copper Alloy |
| Stator Material | Copper Alloy |
| Plating Specification | Contact area and solder area gold plating 1~3u" |
| Coplanarity | 0.10mm MAX |
| Operation Temperature | -40 ~ +85 |
| Operation Humidity | 20-85RH |
| Storage Temperature | -10 ~ +50 |
| Storage Humidity | 20 ~ 85%RH |
| Rated Voltage | 50V (AC/DC) at 20 ambient temperature |
| Rated Current | 0.5A / PIN at 20 ambient temperature |
| Contact Resistance | 30m Max (mated) |
| Insulation Resistance | 500M MIN (between adjacent terminals) |
| Dielectric Strength | 250V AC 1 Minute (between adjacent terminals, no breakdown) |
| Retention Force of Single Pin | 0.2N / PIN MIN (axial pull out) |
| Retention Force of GND Pin | 0.3N / PIN MIN (axial pull out) |
| Retention Force of FFC/FPC | 0.3N Min/Pin (after insertion) |
| Solderability | Easy wetting by melted tin, Tin coverage >90% of dipping area (2455, 3sec) |
| Resistance to Soldering Heat | Contact resistance 50m Max., no damage (260 peak, >230 for 305 sec) |
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