FFC FPC Dual Contact Side Connector DIANWEI 8.01A0.010200 with 0.5mm Pitch and Back Locking Feature

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Delivery Time: Negotiable

Product Description

Product Overview

This specification covers the 0.5mm pitch dual contact side connector with a height of 2.0mm, designed for 0.3mm thick FFC/FPC cables. It features a back-locking mechanism and dual-sided contact for reliable connections. The connector is suitable for a wide range of applications requiring secure and compact interconnect solutions.

Product Attributes

Brand: DIANWEI
Origin: DONGGUAN, CHINA
Certifications: IATF16949, ISO9001:2015, ISO14001, National High-Tech Enterprise

Technical Specifications

Attribute	Specification
Product Series	8.01A
Pitch	0.5mm
Connector Type	FFC/FPC Dual Contact Side Connector
Height (H)	2.0mm
Applicable FFC/FPC Thickness	0.3mm (4-60pin)
Mechanism	Back-locking
Housing Material	LCP Nature Color (UL 94V-0)
Cover Material	LCP Black (UL 94V-0)
Terminal Material	Copper Alloy
Stator Material	Copper Alloy
Contact Type	Double sides contact
Soldering Type	SMT
PCB Thickness Compatibility	T=0.30.02mm
Plating Specification	Contact area and solder area gold plating 1~3u"
Coplanarity	0.10mm MAX
Operation Temperature	-40 ~ +85
Operation Humidity	20-85RH
Storage Temperature	-10+50
Storage Humidity	2085%RH
Rating Voltage	50V (AC/DC) at 20 ambient temperature
Rating Current	0.5A / PIN at 20 ambient temperature
Contact Resistance	30m Max
Insulation Resistance	500M MIN
Dielectric Strength	250V AC 1Minute between adjacent terminal (No Damage/Shorting)
Retention Force of single Pin	0.2N / PIN MIN
Retention Force of GND Pin	0.3N / PIN MIN
Retention Force of FFC/FPC	0.3N Min/Pin (PIN X 0.3N Min)
Shock Test	Acceleration 490m/s, 11ms, 3 times per 6 directions. Discontinuity 1sec, Contact Resistance 50m MAX, No Damage after test.
Vibration Test	Amplitude: 1.52mm, Frequency: 10~55~10Hz. Discontinuity 1sec, Contact Resistance 50m MAX, No Damage after test.
Durability (Lock/Dis-lock)	20 times. Contact Resistance 50m MAX, No Damage.
Heat Resistance Test	852 for 96H. Discontinuity 1sec, Contact Resistance 50m MAX, No damage, Retention force 0.3N/Pin.
Humidity Test	403, 90~95% RH for 96H. Discontinuity 1sec, Contact Resistance 50m Max, Insulation Resistance 500 M Min, Dielectric: No damage, Shorting, Visual ok.
High/Low Temperature Cycle Test	5 cycles. Discontinuity 1sec, Contact Resistance 50 m Max, Visual ok, Retention force 0.3N/Pin.
Salt Spray Test (Gold Plating)	5% salt water density, 351 for 48H. No Corrosion.
Solderability	Dip 3sec in 2455 tin oven. Easy wetting, Tin coverage >90%.
Resistance to Soldering Heat	Preheat: 150~180 (60~120s). Peak temp: 2505, over 230 for 305s. Contact resistance 50m Max, No damage, Retention force 0.3N/Pin.
Recommended Soldering Profile	Preheat: 150~180 (60~120s). Peak temp: 2505, over 225 for 305s. (Lock cover shall be opened during IR reflow)