dual contact side connector 0.5mm pitch rear locking DIANWEI 8.01A0.009200 supports 0.3mm thick cables
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The DIANWEI 8.01A series 0.5mm pitch dual contact side connector is designed for FFC/FPC applications with a height of 2.0mm. It supports 0.3mm thick cables and is available in configurations from 4 to 60 pins. This connector features a rear-locking mechanism and double-sided contact for reliable connections. It is suitable for various electronic applications requiring compact and durable interconnect solutions.
Product Attributes
- Brand: DIANWEI
- Origin: DONGGUAN DIANWEI ELECTRONIC TECHNOLOGY CO.,LTD, CHINA
- Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Series | 0.5mm FFC/FPC Dual Contact Side Connector (H=2.0mm) / 8.01A | PITCH 0.5mm, H=2.0mm, Dual Contact Side Connector, Rear Rotation Locking |
| Applicable Cable Thickness | FFC/FPC | 0.3mm (0.02mm) |
| Pin Count | 4-60pin | (e.g., 4P, 6P, 10P, 12P, 14P, 18P, 24P, 30P) |
| Housing Material | LCP | Nature Color (UL 94V-0) |
| Cover Material | LCP | Black (UL 94V-0) |
| Terminal Material | Copper Alloy | - |
| Stator Material | Copper Alloy | - |
| Contact Type | - | Double sides contact |
| Soldering Type | TML | SMT |
| Plating Specification | Contact area and solder area | Gold plating 1~3u" |
| Coplanarity | - | 0.10mm MAX |
| Operation Temperature | - | -40 ~ +85 |
| Operation Humidity | - | 20-85RH |
| Storage Temperature | - | -10 ~ +50 |
| Storage Humidity | - | 20 ~ 85%RH |
| Rating Voltage | Ambient temperature 20 | 50V (AC/DC) |
| Rating Current | Ambient temperature 20 | 0.5A / PIN |
| Contact Resistance | Mate applicable FPC, 20mV Max. DC, 100mA | 30m Max |
| Insulation Resistance | Apply 250V DC 1Minutes between adjacent terminal | 500M MIN |
| Dielectric Strength | Apply 250V AC 1Minutes between adjacent terminal | No Damage/Shorting |
| Retention Force of Single Pin | Apply axial pull out force at 25~100mm/Min | 0.2N / PIN MIN |
| Retention Force of GND Pin | Apply axial pull out force at 25~100mm/Min | 0.3N / PIN MIN |
| Retention Force of FFC/FPC | Insert FFC, apply axial pull out force at 20~100mm/Min | 0.3N Min/Pin (PIN Count X 0.3N Min) |
| Shock Test | FPC mated, 490m/s, 11ms, 3 times/6 directions | 1sec Max. discontinuity; 50m MAX Contact resistance; No Damage |
| Vibration Test | FPC mated, 1.52mm Amplitude, 10~55~10Hz, 2 hours/axis | 50m MAX Contact resistance; No Damage |
| Durability Test | Lock/dis-lock 20 times with loading | 50m MAX Contact resistance; No Damage |
| Heat Resistance Test | FPC mated, 852 for 96H | 1sec Max. discontinuity; 50m MAX Contact resistance; No damage; Retention force above 0.3N/Pin |
| Humidity Test | FPC mated, 403, 90~95% RH for 96H | 1sec Max. discontinuity; Contact Resistance: 50m Max; Insulation Resistance: 500 M Min; Dielectric: No damage, Shorting; Visual ok |
| High/Low Temperature Cycle Test | FPC mated, 5 cycles | 1sec Max. discontinuity; Contact Resistance: 50 m Max; Visual ok; Retention force above 0.3N/Pin |
| Salt Spray Test (Gold Plating) | 5% salt water, 351, 48H | No Corrosion |
| Solderability Test | Dip soldering tail into Tin oven at 2455 for 3sec | Soldering tail easy wetting, Tin cover over 90% |
| Resistance to Soldering Heat | Preheat: 150180 60~120s; Peak temp: 2505, over 230 last 305s | 50m Max Contact resistance; No damage; Retention force above 0.3N/Pin |
| Recommended Soldering Profile | Preheat: 150180 60~120s; Peak temp: 2505, over 225 last 305s | Reference only; Lock cover must be opened during IR reflow |
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Sellina