Compact 0.5mm Pitch FFC FPC Connector DIANWEI 8.15A0.045200 with Electrical and Mechanical Features

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Product Description

Product Overview

The DIANWEI 0.5mm pitch front-flip FFC/FPC connector, with a height of 1.80mm, is designed for 0.3mm thick cables and supports 4 to 128 pins. It offers reliable electrical, mechanical, and environmental performance suitable for various applications.

Product Attributes

Brand: DIANWEI
Origin: DONGGUAN, CHINA
Certifications: IATF16949, ISO9001:2015, ISO14001, National High-tech Enterprise

Technical Specifications

Specification	Details
Series	0.5mm FFC/FPC Swing Cover Connector (H=1.8 mm) / 8.15A
Applicable Cable Thickness	0.3mm
Pin Count	4-128pin
Housing Material	LCP Nature Color (UL 94V-0)
Cover Material	LCP Black (UL 94V-0)
Terminal Material	Copper Alloy
Stator Material	Copper Alloy
Contact Type	Single side under the contact
Terminal Soldering Type	SMT
PCB Thickness Compatibility	T=0.30.02mm
Plating Specification	Contact area and solder area gold plating 1~3u
Coplanarity	0.10mm MAX
Operation Temperature	-40 ~ +85 (without ice or dew)
Operation Humidity	20-85RH
Storage Temperature	-10+50 (without ice or dew)
Storage Humidity	2085%RH
Rating Voltage	50V (AC/DC) at 20 ambient temperature
Rating Current	0.5A / PIN at 20 ambient temperature
Contact Resistance	30m Max (mated FPC, dry circuit, 20mV Max. AC/DC, 1mA)
Insulation Resistance	500M MIN (DC 100V, 1 minute between adjacent terminals)
Dielectric Withstand Voltage	No Damage/Shorting (AC 250V, 1 minute between adjacent terminals)
Single Pin Retention Force	0.2N/PIN MIN (axial pull out force at 25~100mm/min)
GND Pin Retention Force	0.3N/PIN MIN (axial pull out force at 25~100mm/min)
FFC/FPC Retention Force	0.3N Min/Pin (axial pull out force at 20~100mm/min)
Vibration Resistance	Amplitude: 1.52mm, Frequency: 10~55~10Hz (2 hours in each of 3 axes)
Durability	20 cycles lock/dis-lock with loading
Heat Resistance	96H at 852
Humidity Resistance	96H at 403, 90~95% RH
High/Low Temperature Cycling	5 cycles based on specified table
Salt Spray (Gold Plating)	48H at 5% salt water density, 351
Solderability	Wetting by melted tin over 90% of dipping area (Tin oven 2455, 3 sec)
Resistance to Soldering Heat	Peak temp: 2505, over 230 last 305Sec.
Recommended Soldering Profile	Preheating: 150180 60~120Sec., Peak temp: 2505, over 225 last 305Sec. (for reference, open cover during IR reflow)