FFC FPC dual contact connector DIANWEI 8.04A0.027200 1.0mm pitch compact side type back lock feature

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Product Description

Product Overview

The DIANWEI 8.04A series is a 1.0mm pitch FFC/FPC dual contact side connector with a height of 2.0mm. Designed for 0.3mm thick FFC/FPC cables, it features a back-lock mechanism and dual contact for reliable connections. This connector is suitable for applications requiring a compact and secure connection solution.

Product Attributes

Brand: DIANWEI
Origin: DONGGUAN CITY, CHINA
Certifications: IATF16949, ISO9001:2015, ISO14001, UL 94V-0

Technical Specifications

Attribute	Specification
Series	8.04A
Pitch	1.0mm
Connector Type	FFC/FPC dual contact side connector
Height (H)	2.0mm
Applicable FFC/FPC Thickness	0.3mm (4-40pin)
Housing Material	LCP Nature Color (UL 94V-0)
Cover Material	LCP Black (UL 94V-0)
Terminal Material	Copper Alloy
Stator Material	Copper Alloy
Contact Type	Double sides contact
Soldering Type	SMT
Plating Specification	Contact area and solder area gold plating 1~3u"
Coplanarity	0.10mm MAX
Operation Temperature	-40 ~ +85
Operation Humidity	20-85RH
Storage Temperature	-10+50
Storage Humidity	2085%RH
Rating Voltage	50V (AC/DC) at 20 ambient temperature
Rating Current	0.5A / PIN at 20 ambient temperature
Contact Resistance	30m Max
Insulation Resistance	500M MIN
Dielectric Strength	No breakdown, no short circuit at 250V AC for 1 minute between adjacent terminals
Retention Force of single Pin	0.2N / PIN MIN
Retention Force of GND Pin	0.3N / PIN MIN
Retention Force of FFC/FPC	0.3N Min/Pin (PIN Count X 0.3N Min)
Shock Resistance	Acceleration 490m/s, 11ms, 3 times in each of 6 directions
Vibration Resistance	Amplitude: 1.52mm, Frequency: 10~55~10Hz for 2 hours in each of 3 axes
Durability (Lock/Dis-lock)	20 times
Heat Resistance	852 for 96H
Humidity Resistance	403, 90~95% RH for 96H
High/Low Temperature Cycling	5 cycles
Salt Spray (Gold Plating)	351, 5% salt water density for 48H
Solderability	Wetting by melted tin over 90% of dipping area at 2455 for 3sec
Resistance to Soldering Heat	Peak temperature: 260, over 230 for 305Sec.
Recommended Soldering Profile	Preheating: 150180 60~120Sec., Peak temperature: 2505, over 225 for 305Sec. (Lock cover shall be opened)