DIP wafer connector DLL QAC-11S with phosphor bronze tin plated terminals and UL94V 0 certification

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The 2.50 mm Pitch Wire-to-Board DIP Wafer and Housing series from ZHE JIANG DELI CONNECTORS CO., LTD. offers a reliable solution for various electronic interconnections. Designed for durability and performance, these connectors are suitable for a wide range of applications requiring secure and efficient wire-to-board connections.

Product Attributes

Brand: DELI CONNECTORS
Origin: ZHE JIANG
Material (Housing): PA66 UL94V-0(2)
Material (Pins/Terminal): Brass / Tin-Plated (Wafer), Phosphor bronze, Tin plated (Terminal)
Certifications: UL94V-0

Technical Specifications

Product Name	Type	Circuits	Pitch	Rated Voltage	Rated Current	Contact Resistance	Insulation Resistance	Withstand Voltage	Ambient Temperature	Mates With
QAC-AS Series	DIP Wafer	2-15	2.50 mm	250V AC.DC	3A AC DC MAX	20 m	500 M	1100V AC/minute	-40+105	QAC-Y Series Housing
QAC-AWS Series	DIP Wafer	2-15	2.50 mm	250V AC.DC	3A AC DC MAX	20 m	500 M	1100V AC/minute	-40+105	QAC-Y Series Housing
QAC-AWD Series	DIP Wafer	2-15	2.50 mm	250V AC.DC	3A AC DC MAX	20 m	500 M	1100V AC/minute	-40+105	QAC-Y Series Housing
QAC-Y Series	Housing	2-15	2.50 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	QAC series housing
QAC-R Series	Housing	2-15	2.50 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	QAC-Y series housing
QAC-S Series	Housing	2-15	2.50 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	QAC-Y/QAC-R series housing
QAC-T	Crimp Terminal	N/A	2.00 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	QAC-Y Series Housing
QAC-T-G	Crimp Terminal	N/A	2.00 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	N/A
QAC-RT	Crimp Terminal	N/A	2.00 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	QAC-R Series Housing
QAC-RT-G	Crimp Terminal	N/A	2.00 mm	250V AC.DC	3A AC DC	20 m	500 M	1100V AC/minute	-40+105	N/A