Durable Wire to Board SMT Wafer Connector DLL PHM-4SG Featuring LCP UL94V-0 and Brass Pin Material
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The 2.00 mm Pitch Wire to Board SMT Wafer series offers reliable connection solutions for various electronic applications. Designed for surface mount technology, these wafers provide a secure and efficient interface between wires and PCBs.
Product Attributes
- Brand: ZHE JIANG DELI CONNECTORS CO., LTD
- Origin: China
- Material (Wafer): LCP UL94V-0, PA66 V0/V1/V2, PA9T, PA6T, GF PA66, PBT UL94V-0
- Material (Pin): Brass, Tin Plated
- Certifications: UL94V-0
Technical Specifications
| Product Name | Circuits | Rated Current | Rated Voltage | Contact Resistance | Insulation Resistance | Withstand Voltage | Ambient Temperature | Wafer Material | Pin Material |
| DL20040(PHM)-AB Series | 2-15 | 3A AC/DC | 125V AC/DC | 20m max | 1000M min | 500V AC/minute | -40 to 105 | LCP UL94V-0 | Brass / Tin-Plated |
| DL20040(PHM)-AWB Series | 2-15 | 3A AC/DC | 125V AC/DC | 20m max | 1000M min | 500V AC/minute | -40 to 105 | LCP UL94V-0 | Brass / Tin-Plated |
| DL20040(PHM)-Y Series | 2-15 | 3A AC/DC | 125V AC/DC | 20m max | 1000M min | 500V AC/minute | -40 to 105 | PBT UL94V-0 | Brass / Tin-Plated |
| DL20062-Y-SG Series | 2-15 | 3A AC/DC | 125V AC/DC | 20m max | 1000M min | 500V AC/minute | -40 to 105 | PBT UL94V-0 | Brass / Tin-Plated |
| DL20062-SG Series | 2-15 | 3A AC/DC | 125V AC/DC | 20m max | 1000M min | 500V AC/minute | -40 to 105 | PBT UL94V-0 | Brass / Tin-Plated |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina