2.00 mm Pitch Wire To Board SMT Wafer DLL PHM-5SG Offering Durable And Stable Electronic Connections

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Product Description

Product Overview

The 2.00 mm Pitch Wire To Board SMT Wafer series offers reliable connectivity solutions for various electronic applications. Designed for SMT mounting, these wafers provide a robust connection between wires and printed circuit boards.

Product Attributes

  • Brand: ZHE JIANG DELI CONNECTORS CO .,LTD
  • Origin: China
  • Material (Wafer): LCP UL94V-0, PA66, PA9T, PA6T, GF PA66, PBT UL94V-0
  • Material (Pin): Brass, Phosphor Bronze
  • Finish (Pin): Tin Plated, Tin, Matt Tin, Gold, Silver
  • Certifications: UL94V-0

Technical Specifications

Product NameNo. of CircuitsRated CurrentRated VoltageContact Resistance (max)Insulation Resistance (min)Withstand VoltageAmbient TemperatureWafer MaterialPin MaterialPin Finish
DL20040(PHM)-AB Series2-153A AC/DC125V AC/DC20m1000M500V AC/minute-40 to 105LCP UL94V-0BrassTin Plated
DL20040(PHM)-AWB Series2-153A AC/DC125V AC/DC20m1000M500V AC/minute-40 to 105LCP UL94V-0BrassTin Plated
DL20040-XXY-XXX-XX Series (Housing)2-15------PBT UL94V-0--
DL20062-Y-SG Series (Housing)2-15------PBT UL94V-0--
DL20062-SG(PHM-SG) Series (Housing)2-15------PBT UL94V-0--
DL20040(PHM)-T-D (Crimp Terminal)--------Phosphor BronzeTin plated
DL20040(PHM)-T-G (Crimp Terminal)--------Phosphor BronzeTin plated

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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