Compact footprint NGFF memory module socket FOXCONN AS0BC21-S30BB-7H with black halogen free housing
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The AS0BC2*-S30B*-7H is a NGFF (Next Generation Form Factor) memory module socket designed for horizontal mounting on PCBs. It features a compact design with a 0.5mm pitch and supports SMT processing with a peak temperature of 260C for 10-20 seconds. This socket is suitable for applications requiring high-density memory solutions.
Product Attributes
- Brand: HON HAI PRECISION IND. CO.,LTD.
- Origin: TAIPEI, TAIWAN, R.O.C.
- Housing Material: THERMOPLASTIC 1 UL94V-0, HALOGEN FREE
- Housing Color: BLACK
- Certifications: HALOGEN/LEAD FREE
Technical Specifications
| Part Number Suffix (Key) | Contact Area Plating | Height | Tape & Reel | Board Lock | Material | QTY | Treatment | DIM.A (mm) | DIM.B (mm) | DIM.C (mm) | DIM.D (mm) | DIM.E (mm) | DIM.F (mm) | DIM.G (mm) |
| AS0BC2*-S30BM-7H (M) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 14.0 | 3.0 | 13.0 | 2.0 | 1.125 | 1.375 | 6.125 |
| AS0BC2*-S30BL-7H (L) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 13.0 | 3.0 | 13.0 | 2.0 | 1.125 | 1.375 | 5.125 |
| AS0BC2*-S30BK-7H (K) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 12.0 | 4.0 | 12.0 | 2.0 | 1.125 | 1.375 | 4.125 |
| AS0BC2*-S30BJ-7H (J) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 11.0 | 5.0 | 11.0 | 2.0 | 1.125 | 1.375 | 3.125 |
| AS0BC2*-S30BH-7H (H) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 10.0 | 6.0 | 10.0 | 2.0 | 1.125 | 1.375 | 2.125 |
| AS0BC2*-S30BG-7H (G) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 9.0 | 7.0 | 9.0 | 2.0 | 1.125 | 1.375 | 1.125 |
| AS0BC2*-S30BF-7H (F) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 9.50 | 6.0 | 9.5 | 2.0 | 1.375 | 1.125 | 1.625 |
| AS0BC2*-S30BE-7H (E) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 10.50 | 5.0 | 10.5 | 2.0 | 1.375 | 1.125 | 2.625 |
| AS0BC2*-S30BD-7H (D) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 11.50 | 4.0 | 11.5 | 2.0 | 1.375 | 1.125 | 3.625 |
| AS0BC2*-S30BC-7H (C) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 12.50 | 3.0 | 12.5 | 2.0 | 1.375 | 1.125 | 4.625 |
| AS0BC2*-S30BB-7H (B) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 13.50 | 2.0 | 13.5 | 2.0 | 1.375 | 1.125 | 5.625 |
| AS0BC2*-S30BA-7H (A) | GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, GOLD FLASH PLATING AT TAIL AREA | 14.50 | 1.0 | 14.5 | 2.0 | 1.375 | 1.125 | 6.625 |
| AS0BC2*-S30B*-7H | 10u" GOLD PLATING / GOLD FLASH | 3.0mm | TAPE&REEL | BOARD LOCK | COPPER ALLOY | 67 | 10u" NICKEL UNDER PLATING, 100u"MATTE TIN PLATING OVER ALL CONTACT, 10u" GOLD PLATING OR GOLD FLASH AT CONTACT AREA | 21.9 | 20.15 | 20.0 | 7.2 | 1.10 0.05 | 0.50 | 2.50 |
| Specification | Value |
| Contact Current Rating | 0.5 Ampere Max. Per Pin |
| Voltage Rating | 50V AC |
| Insulation Resistance | 500 Megaohms Min. At 500V DC |
| Dielectric Withstanding Voltage | 300V AC RMS At 60Hz, For 1 Minute |
| Contact Resistance (Initial) | 55 Milliohms Max. Per Pin |
| Contact Resistance (After Environment Testing) | 20 Milliohms Max. Per Pin |
| Durability | 60 Mating Cycles |
| Operation Temperature | -40 C To +80 C |
| SMT Process Peak Temperature | 260 C, 10~20S |
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