NGFF SMT socket FOXCONN AS0BC27-S40BM-7H with thermoplastic housing and copper alloy contact materials
Product Overview
The AS Series NGFF Socket is a high-quality SMT (Surface Mount Technology) connector designed for memory module applications. It features a 0.50mm pitch and 75 positions, offering a reliable solution for data storage interfaces. Available in 3.0mm and 4.0mm heights, this socket is built with durable materials and adheres to strict electrical and mechanical standards.
Product Attributes
- Brand: Foxconn
- Type: NGFF Single Row Horizontal Type Memory Module Socket
- Housing Material: Thermoplastic, UL 94V-0 rated
- Housing Color: Ivory
- Contact Material: Copper alloy
- Metal Spring Material: Copper alloy
- Certifications: UL 94V-0 rated
Technical Specifications
| Model | Height | Type | Pitch | Positions | Mechanical Retention Force (min) | Durability | Voltage Rating | Current Rating | Contact Resistance (max) | Dielectric Withstanding Voltage | Insulation Resistance (min) | Operating Temperature |
| AS Series 3.0mm Height | 3.0mm | SMT | 0.50mm | 75 | 0.10kg | 60 Cycles | 50V | 0.5A | 55m | 300V AC/1 min | 500M | -40 to +80 |
| AS Series 4.0mm Height | 4.0mm | SMT | 0.50mm | 75 | 0.10kg | 60 Cycles | 50V | 0.5A | 55m | 300V AC/1 min | 500M | -40 to +80 |
Ordering Information
PART NO. : SMT STANDARD TYPE A S 0 BC 2 * S ** * 7 H B
KEY: 30=3.0mm HEIGHT, 40=4.0mm HEIGHT, B=BLACK COLOR, 7=TAPE&REEL, H=HALOGEN/LEAD FREE, BC=0.5P, NGFF SINGLE ROW HORIZONTAL TYPE MEMORY MODULE SOCKET
CONTACT AREA PLATING: 1=GOLD FLASH, 6=10u" GOLD PLATING, Y=5u" GOLD PLATING, 7=15u" GOLD PLATING, 3=30u" GOLD PLATING
DIM.P TYPE: 3030, 3042, 2230, 2242, 2260, 2280, 22110
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