PCB Mount Hanbo Electronic WAFER-HY200DZ with Brass Contact Nickel Underplating and Tin Overplating
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product features a brass contact with tin plating over nickel, housed in a white LCP/PA66 (UL94V-0) base. It is designed for PCB mounting with specific layout recommendations and offers robust electrical and environmental performance.
Product Attributes
- Material (Contact): Brass
- Plating (Contact): Nickel underplating, Tin overplating (30U"MIN Nickel, 80UMIN Tin)
- Material (Base/Wafer): LCP/PA66 (UL94V-0)
- Color (Base/Wafer): White
Technical Specifications
| Item | Base/Wafer | Contact | Material | Plating | Dimensions (A) | Dimensions (B) | Dimensions (C) | Dimensions (Overall) | Contact Resistance | Insulation Resistance | Rated Voltage | Rated Current | Dielectric Strength | Operating Temperature | Solderability |
| 1 | LCP/PA66 (UL94V-0) | Brass | LCP/PA66 (UL94V-0) | Nickel (30U"MIN) + Tin (80UMIN) | A0.2 | B0.2 | C0.15 | 5.100.2 | 10m | 1000M | 250V AC/DC | 2.0A AC/DC | 1000V AC/Minute | -25C to +85C | Immersion area 95%, Temp 2205C, Time 2.50.5s |
Environmental Compliance: Lead and cadmium content meets environmental requirements.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina