Hanxia HX NANO SIM 7P-Iw H1.35 sim card holder suitable for various electronic connector applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The HX NANO SIM 7P-Iw H1.35 is a SIM card holder designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. This product specification outlines its characteristics, test methods, and performance requirements for electrical connectors.
Product Attributes
- Brand: HX NANO SIM
- Origin: Shenzhen Hanxia Electronic Co., Ltd.
- Material: Compliant with RoHS directive.
- Certifications: UL498 (referenced for temperature rise)
Technical Specifications
| Part No. | Product Name | Material Code | Rev. | Page No. | Scope | Reference Documents | Product Dimension | PCB/Panel Layout | Mechanical & Electrical Characteristic | Packaging | Marking | Transportation | Storage | Environmental Requirements | Performance & Test Description |
| HX NANO SIM 7P-Iw H1.35 | SIM Card Holder | HX NANO SIM 7P-Iw H1.35 | A | 1/8 | This product specification specifies the characteristics and test methods of the connector products designed and manufactured by the Company. | MIL-STD-1344A, MIL-STD-202F, EIA364, JIS C 0051, MIL-G-45204C, IEC-512-3, QQ-N-290A, MIL-P-81728A, MIL-T-10727B, UL498, EN/ISO5961, EN1122, EN13346, EPA3052 | As shown in customer drawing. | As shown in customer drawing. | As described in Table I. | Packaged according to requirements specified in purchase order for safe delivery. Products required tray or carrier tape should meet the proper specification per purchase order. Connector container and the packaging specification is shown in customer drawing. | Manufacturers name, industry recognized logo, or customer approved marks. | Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage. | Temperature: -20~+70, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test shall be conducted immediately while the storage duration exceed 6 months. | Solderability, Resistance to Solder Heat (Wave Soldering, Infrared Reflow), Cleaning. | Product is designed to meet electrical, mechanical, and environmental performance requirements specified in Table I. Test samples shall be selected at random from current production. No test samples shall be reused. Samples are pre-conditioned with 10 cycles of durability. Each group shall be containing 5 test samples. Products qualification test sequence as shown in Table II. |
Performance Requirements (Table I)
| Items | Requirements | Test Methods |
| 1. Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 50 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| 3. Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing | Mate and unmate connector for 3000 cycle. |
| 6. Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| 7. Vibration Sinusoidal Low Frequency | No electrical discontinuity greater |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina