HX NANO SIM XG6P H1.35 SIM card holder manufactured to meet stringent and safety standards in electronics
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product specification details the characteristics and test methods for connector products designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. The HX NANO SIM XG6P H1.35 is a SIM card holder designed for various applications, adhering to strict environmental and performance standards.
Product Attributes
- Brand: Shenzhen Hanxia Electronic Co., Ltd
- Product Name: SIM (SIM Card Holder)
- Part Number: HX NANO SIM XG6P H1.35
- Origin: Shenzhen, China
- Material: Compliant with RoHS directive for harmful materials.
- Certifications: UL498 (for safety of attachment plug and receptacle)
Technical Specifications
| Item | Requirements | Test Methods |
|---|---|---|
| Product Confirmation | Conforming to applicable product drawing requirements. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact Resistance (Low Level) | 100 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation Resistance | 1000 M Min. | Measure by applying test potential between adjacent contacts, and between contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | Withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between adjacent contacts, and between contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing. | Mate and unmate connector for 5000 cycles. |
| Temperature Rise | 30C Max. | Carry rated current load (0.3A per contact) as per UL498. |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity. | (Details not fully provided in source text) |
| Storage Temperature | -20 to +70 | Relative humidity 80%. Not to store in corrosive environments. Re-qualification after 6 months storage. |
| Solderability | Meet MIL-STD-202F standard. Surface free of contaminants. | (Details not fully provided in source text) |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Not to exceed 4/sec, final preheat within 125 of solder temp. Soldering: Max 250 for 5 seconds. Cool Down: Ambient air approx. 20-25. | (Details not fully provided in source text) |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Not to exceed 4/sec. Soldering: Max 90 sec above 183, max 260 for 10 sec. Cool Down: Not to exceed 6/sec. | Device temperature measured from top-center of package outer surface. |
| Cleaning | Resist to cleaning process. | Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying at 93-121 for 60-90 seconds. (Three cycles). |
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