Hanxia HX TF 01A T Flash Card Holder Connector with Comprehensive Testing Ensuring Electrical Performance

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Product Description

Product Overview

This product specification defines the product performance and test methods for the T-FLASH card holder connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is suitable for various applications requiring reliable connection and compliance with industry standards.

Product Attributes

Brand: HX
Origin: Shenzhen, China
Material: Compliant with RoHS directive for harmful materials.
Certifications: UL498 (Safety of attachment plug and receptacle)

Technical Specifications

Item	Requirements	Test Methods
1. Confirmation of Product	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
2. Contact resistance (Low Level)	40 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
4. Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
5. Durability (Repeated Mating/Unmating)	Contact Resistance: 100 m Max. after testing	Mate and unmate connector for 5000 cycles.
6. Temperature rise	30 C Max.	Carry rated current load (0.3A per contact) (UL498).
7. Vibration Sinusoidal Low Frequency	No electrical discontinuity greater than 1 sec (s) shall occur. Contact resistance: 100 m max.	Subject mated connector to 10-55-10 Hz traversed in 1 minute at 1.5 mm amplitude 2 hours each of 3 mutually perpendicular planes, 10 mA applied. MIL-STD-202, Method 201.
8. Shock	No electrical discontinuity greater than 1 sec (s) shall occur. No damage to product.	Applying an appropriate holder is allowed in vibration test and shock test. MIL-STD-202, Method 213, 490 m/s, 3 axes.
9. Thermal shock	No damage, Contact Resistance (Low Level) (Final) 100 m max.	Temperature range from -55C to +85C. After 30 min. change to +85C, change time is no more than 30 seconds. Total 5 cycles. MIL-STD-202, Method 107D, condition A.
10. Humidity	No damage, Contact Resistance (Low Level) (Final) 100 m max. Dielectric Strength should be OK, Insulation Resistance should be 100 M min.	Temperature: 40 2 C 96 hours. Relative humidity: 90-95%; Duration: 96 Hours. MIL-STD-202, Method 103.
11. Solderability	Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnification of 10 X for any damage such as pinholes, void or rough surface.	Soldering time: 3 to 5 Seconds. Temperature: 2555C.
12. Resistance to soldering heat	No damage	Leave subject product in the 2555C chamber for 2 minutes.
13. Salt Spray	Contact Resistance (Low Level) (Final) 100 m max.	51% salt concentration 24 4 hours 35 2C. MIL-STD-202, Method 101 Condition B.
14. High temperature	Contact resistance: 100 m max.	Subject product to 852C for 96 hours continuously. MIL-STD-202, Method 108.