Secure and hanxia HX SD CARD 11P connector ideal for demanding electronic data transfer applications

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Product Description

Product Overview

This product specification details the characteristics and test methods for the HX SD-CARD 11P connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a high-quality SD card connector suitable for various applications requiring reliable data transfer and connectivity.

Product Attributes

Brand: HX
Origin: Shenzhen, China
Manufacturer: Shenzhen Hanxia Electronic Co., Ltd.
Material Compliance: RoHS

Technical Specifications

Item	Requirements	Test Methods
Product Confirmation	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
Contact Resistance (Low Level)	40 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation Resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%).
Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
Durability (Repeated Mating/Unmating)	Contact Resistance: 150 m Max. after testing. Mate and unmate connector for 5000 cycles.	Completed mating/unmating tests.
Temperature Rise	30C Max.	Carry rated current load. 0.3A per contact. (UL498)
Vibration Sinusoidal Low Frequency	No electrical discontinuity greater than 1 s.	MIL-STD-202, Method 204, Condition D.
Shock	No electrical discontinuity greater than 1 s.	MIL-STD-202, Method 213, Condition A.
Solderability	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.	N/A
Resistance to Solder Heat (Wave Soldering)	Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.	N/A
Resistance to Solder Heat (Infrared Reflow)	Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.	N/A
Cleaning	Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.	N/A